Lanxide Technology Company, LP

Peter M Engelgau

Danny R White

Alan S Nagelberg

Michael A Rocazella

Steven D Keck

Marc S Newkirk

Michael K Aghajanian

Christopher R Kennedy

Gregory E Hannon

John T Burke

Robert J Wiener

Cheng-Tsin Lee

The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its performance or bonding capabilities.

Methods of forming electronic packages

The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Particularly, an infiltration enhancer and/or infiltration enhancer precursor and/or infiltrating atmosphere are in communication with a filler material or a preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform, the infiltrated material is bonded to the second material, thereby forming a sealable electronic package.

Method of forming electronic packages

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Dover, DE, United States of America

Peter M Engelgau