International Business Machines Corporation

Peter M Elenius

Brian Michael Kerrigan

James Marc Leas

Norman J Dauerer

Glenn Graham Daves

Joseph Michael Sullivan

Robert P Phillips, Iii

Dennis Felix Clocher

Joseph John Lisowski

Wagih M Wazni

David E Eisenmann

Robert O Lussow

Helmut Krueger

A high performance, low cost multi-chip module package using a heatsink as a substrate with thin film wiring techniques or multilayered wiring techniques for interconnection of the chips on the surface of the module and a solder column grid array or solder ball grid array for interconnection to the next level of packaging (printed circuit board). The columns or balls create a space between the board and module with the chips being in the space and provide the required interconnect density.

High performance, low cost multi-chip modle package

This invention is an improved method and apparatus for applying fluids onto a selected area of a component. The method uses a thin film or membrane formed by placing a forming tool in the fluid to be applied. A thin film or membrane is formed across the forming tool, which is analogous to a soap bubble formed across a bubble wand dipped into a soap bubble solution. The thin film is brought into contact with the area of the component to be coated thereby resulting in the transfer of the thin film onto the component and a variation of the thin fluid film or membrane forming tool that allows for a continuous feed application.

Non-contact fluid applicator apparatus and method

A method and apparatus for cooling thermally massive parts includes directing a chilled gas onto an electrical component travelling on the belt of a continuous furnace. The belt is divided into a series of hot and cold zones to provide thermal stressing to the electrical component to detect early life failure. As the component cools, a constant thermal stress is maintained by either lowering the temperature or increasing the flow rate of the chilled gas.

Method and apparatus for cooling thermally massive parts in a continuous

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Hopewell Junction, NY, United States of America

Peter M Elenius