International Business Machines Corporation

Peter M Banks

William M Morgan

Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.

Manufacturing circuit boards dipped in molten solder

Apparatus for application to a circuit board

Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

Solder application to a circuit board

Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The board is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

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Chandlers Ford, United Kingdom

Peter M Banks