Other

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Elektronik-Grundstoffe Mbh

Peter Lehfeld

Holger Lundt

Bert Ripper

Robert Hofmann

Leopold Neussl

Wolf-R&uuml;diger Kurtze

Helmut Seeburger

Wolf-Rudiger Kurtze

There is an annular or internal-diameter saw and a method of protecting the clamping edge and of cleaning the saw blade of this annular or internal-diameter saw. The annular or internal-diameter saw has an element which partly screens the clamping edge and is arranged in the vicinity of the clamping edge and the saw blade, and has an outer material layer on the clamping edge. The outer material layer faces the element and is substantially harder than a clamping edge material lying behind it. The method is distinguished by the fact that workpiece residues thrown against the clamping edge are shattered when striking the clamping edge. This is due to the fact that an element partly screening the clamping edge is provided in the vicinity of the clamping edge and the saw blade. Also, the clamping edge is given high strength by virtue of the fact that an outer material layer on the clamping edge facing the element is produced from a material which is substantially harder than a clamping edge material lying behind it.

Annular saw and method of protecting the clamping edge and of cleaning the saw blade of an annular saw

Material removing machining is for wafer shaped workpieces, in particular semiconductor wafers. There is a method for achieving a wear performance which is as linear as possible for a tool which has an essentially planar working surface for the material removing machining of wafer shaped workpieces. The tool has a wear performance which is as linear as possible. There are also a method and a device for measuring a wear profile on an essentially planar working surface for the material removing machining of wafer shaped workpieces. There is also a carrier which is used for the two-sided material removing machining of wafer shaped workpieces.

Method for achieving a wear performance which is as linear as possible

A device and method for resharpening the cutting edge of saws used in particular in the centerhole sawing of semiconductor bars. It contains a sharpening system which consists of at least one elongate sharpening stone facing the cutting edge with its end face, is movable laterally relative to the saw blade and has at the end face two working surfaces which are located opposite one another and, during sharpening, can be brought into contact laterally with the cutting-edge surface facing them. The device affords trouble-free operation and permits sharpening actions during the sawing operations.

Method and device for resharpening saws especially used for making

Growing community of inventors

Burghausen, Germany

Peter Lehfeld