Infineon Technologies Ag

Conti Temic Microelectronic Gmbh

Peter Knittl

Michael A Thomas

Helmut Seidel

Ulrich Prechtel

Manfred Weinacht

Konrad Kapser

Sebastian Toelg

A tire monitoring system and associated method is disclosed. The tire monitoring system includes a plurality of tire sensor modules, employing contactless sensors, configured to transmit tire data at a predetermined time interval. The system also includes a central control unit that is configured to receive the tire data from the tire sensor modules, and is further configured with an external control unit that can communicate with the tire sensor modules, the central control units and outside sources.

Contactless sensor systems and methods

A leadframe includes at least one lead extending from an integrated circuit and terminating at a connector pin. The lead includes multiple predefined bases to connect to one or more components external to the integrated circuit.

Advanced leadframe having predefined bases for attaching passive components

One or more aspects of the present invention relate to a wireless switch component and an associated control module component that facilitate wireless control over a load device. The load device is operatively coupled to the control module component and is selectively activated thereby in accordance with a wireless control signal sent by the wireless switch component.

Smart wireless switch

In accordance with one or more aspects of the present invention, a wireless sensing system is disclosed, where the system has particular application to sensing the speed of a vehicle wheel, for example. To sense wheel speed, a sensing unit senses changes in magnetic flux and wirelessly relays a signal indicative thereof back to a base station or control unit.

Wireless wheel speed sensor

A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (), a sensor inertia mass () made of a wafer and movably mounted relative to the frame structure () about a rotation axis, and a capacitive pick-up unit () for producing at least one capacitive output signal representing the position of the sensor mass () relative to the frame structure (). The sensor inertia mass () has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass () and the frame structure () are made monolithically of one single crystal silicon wafer. A cover section () forms a common connector plane () for the connection of capacitor electrodes (). Torqueable elements () form an electrically conducting bearing device for the sensor mass ().

Growing community of inventors

Kelheim, Germany

Peter Knittl