Rf360 Singapore Pte. Ltd.

Epcos Ag

Peter Kirchhofer

Volker Schulz

Nadine Erhard-egeler

Andreas Detlefsen

Stefan Leopold Hatzl

Franz Kubat

Manuel Hofer

Dietmar Ritter

Simone Colasanti

Philipp Schwegler

Aspects of the disclosure relate to devices, wireless communication apparatuses, methods, and circuitry implementing bulk wave suppression in a stacked electroacoustic device. One aspect includes a first substrate comprising a first surface and a second surface, where the second surface is opposite the first surface, a first AW resonator circuit positioned on the first surface of the first substrate, a plurality of elements including a first element, where the plurality of elements are positioned on the second surface of the first substrate, and where the first element is aligned with the first AW resonator circuit, and a second substrate comprising a first surface and a second surface, where the plurality of elements are positioned on the first surface of the second substrate, and where the plurality of elements create a cavity between the first substrate and the second substrate.

Stacked acoustic wave (AW) packages with reduced excitation of reflected bulk waves

A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second substrate has a second AW filter circuit disposed in a cavity between the metal layer of the first substrate and a third surface of the second substrate. The metal layer is coupled to the second AW filter circuit by a metal interconnect formed in a metallization layer on a side surface of the first substrate. The metal layer provides isolation to reduce cross-talk (e.g., electromagnetic interference) within the stacked AW filter package between the first AW filter circuit and the second AW filter circuit. Including the metal layer in the stacked AW filter package improves signal quality of transmitted and received signals filtered in the first and second AW filter circuits.

Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods

An apparatus includes a piezoelectric substrate having a signal line with a first electrical port and a second electrical port, and a first partial filter connected in series with a second partial filter. The partial filters are arranged between the electrical ports. The first partial filter includes a first serial transducer and a second serial transducer located in an acoustic path and in series branches of the signal line. The serial transducers are acoustically coupled with one another. The second partial filter includes a coupler transducer and an end-positioned transducer that are located in a double mode surface acoustic wave (DMS) path. The end-positioned transducer is positioned at an end of the signal line.

Electronic component operated with surface acoustic waves

Growing community of inventors

Munich, Germany

Peter Kirchhofer