Kulicke and Soffa Industries, Inc.

Peter Julius Klaerner

Jason Fu

Christoph Benno Luechinger

Devesh Sharma

Eric T Scranton

Karthik Gundappa Balte

Henri Seppaenen

Jose De Jesus Lozano De Alva

Masih Mahmoodi

A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.

Methods of determining and/or calibrating a cutter height on a wedge bonding machine, and related wedge bonding machines

A method of cleaning a tip of a wire bonding tool on a wire bonding machine is provided. The method includes the steps of: (a) moving a wire away from the wire bonding tool such that the tip of the wire bonding tool is accessible to a cleaning station of the wire bonding machine; and (b) cleaning at least a portion of the tip of the wire bonding tool with the cleaning station after step (a).

Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods

An ultrasonic welding system is provided. The ultrasonic welding system includes a sonotrode configured to ultrasonically weld a conductive pin to a workpiece. The ultrasonic welding system also includes a pin feeding system configured to feed the conductive pin to the sonotrode, the pin feeding system including a pin supply tube.

Ultrasonic welding systems for conductive pins, and related methods

A method of operating a pattern recognition system of an electronic device packaging machine is provided. The method includes the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) utilizing a pattern recognition recipe in connection with an image from step (a) to determine if an acceptable level of matching occurs; and (c) automatically varying at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if the acceptable level of matching does not occur in step (b).

Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).

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Corona, CA, United States of America

Peter Julius Klaerner