Ford Motor Company Limited

Visteon Global Technolgoies, Inc.

Other

Peter Joseph Sinkunas

Andrew Zachary Glovatsky

Michael George Todd

Myron Lemecha

Lakhi Nandlal Goenka

Jay DeAvis Baker

Zhong-You Joe Shi

Zhong-You (Joe) Shi

Yutaka Kawase

Anne Marie Sullivan

Xu Song

Guilian Gao

Robert Edward Belke

Lawrence LeRoy Kneisel

Brenda Joyce Nation

Charles Frederick Schweitzer

Bernard A Meyer

Stephen Fuks

Jeff J Lin

Victor V Zaderej

Bhavani Shankar Tata

Rexanne M Coyner

Rodney L Ritter

Cuong-Van Pham

Larry N Schmidt

Sherwin T Moss

Lawrence L Bullock

James E Altpeter

Raymond Eric Foster

Stephen H Wong

A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.

Vector transient reflow of lead free solder for controlling substrate warpage

A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.

System and method for joining flat flexible cables

A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Flex to flex soldering by diode laser

A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

System and method for repairing flex circuits

A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Flatwire repair tool systems and methods

A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.

Flatwire jumper patch

A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.

System and method for mounting electronic components onto flexible substrates

A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.

Method for soldering surface mount components to a substrate using a laser

There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component,having at least two terminations thereon; a dielectric substrate,having a first surface,on a first side thereof, a second surface on a second side thereof, and at least two mounting pads,arranged on the first surface,in matched relation with the terminations of the electronic component,; and a diode laser,; (b) depositing solder paste atop the mounting pads,; (c) placing the electronic component,atop the substrate,such that each termination rests generally atop its respective mounting pad,; and (d) directing laser energy,from the diode laser,to at least one of the mounting pads,from the second side of the substrate,for a predetermined time, such that the solder paste atop the at least one of the mounting pads,is melted.

Method for laser soldering a three dimensional component

There is disclosed herein a method for soldering an electronic component,having a heatspreader,on a bottom surface thereof and at least one lead,(e.g., a DPAK-type component) to a circuit board,having a heatspreader mounting pad,and at least one lead mounting pad,, comprising the steps of: (a) depositing solder paste,on the heatspreader mounting pad,and on each of the at least one lead mounting pad,; (b) placing the electronic component,on the circuit board,such that the heatspreader,rests atop the heatspreader mounting pad,and each lead,rests atop a respective one of the at least one lead mounting pad,; (c) directing a laser energy beam,from a diode laser,at the heatspreader,and/or at the heatspreader mounting pad,for a first predetermined length of time, thereby heating the solder paste,on the pad,; and (d) continuing to direct the laser energy beam,at the heatspreader/pad,for a second predetermined length of time while simultaneously feeding a predetermined amount of flux-core wire solder,into the laser energy beam,proximate the heatspreader,, such that the wire solder,melts and flows onto at least one of the heatspreader,and the heatspreader mounting pad

Method for soldering DPAK-type electronic components to circuit boards

A three-dimensional multi-layer electronic device and method for manufacturing same, wherein the device comprises a three-dimensional substrate including a conductive trace on at least one surface of the substrate, a thin layer of dielectric material substantially covering a desired portion of the conductive trace(s) on the substrate, the dielectric layer including vias at selected locations, and applying a coating of conductive material on the dielectric layer and in the vias, and defining a conductive trace in the material to thereby form a multi-layer, interconnected three-dimensional electronic device. Additional layers of dielectric material and conductive traces may be similarly applied to create the desired number of circuit layers. Molded-in structural features, and/or vias may be defined in the appropriate layers to accommodate the attachment and/or interconnection of other electronic devices to the device.

Three-dimensional electronic circuit with multiple conductor layers and

A circuit board assembly is disclosed comprising a pair of three-dimensional substrates having integral, metallized connectors. The connector of the first substrate protrudes therefrom, while the connector of the second substrate is recessed therein. The geometries of the protruding connector and the recessed connector are different such that they deform when assembled to provide an electrical connection and a detachable physical connection. In one embodiment, the recessed connector has a parabolic cross-section and the protruding connector has a circular cross-section. A flexible molded edge connector for the circuit board assembly is also disclosed.

Three-dimensional molded circuit board having interlocking connections

There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.

Heat spreader mounting pad configurations for laser soldering

A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.

Three-dimensional multi-layer molded electronic device and method for

An inert gas air horn distribution device employs a labyrinth with a baffle to clean the nitrogen gas used to deposit flux on circuit boards before wave soldering operations. The baffle diverts the gas flow causing heavier flux particles to collect in the labyrinth while the lighter gas exits for use in depositing flux on the circuit boards. The labyrinth cleans the gas thereby keeping the knife clean which produces more uniform results with less maintenance.

Growing community of inventors

Canton, MI, United States of America

Peter Joseph Sinkunas