Memjet Technology Limited

Silverbrook Research Pty Ltd

Zamtec Limited

Peter John Morley Sobey

Eric Patrick O'Donnell

Craig Donald Strudwicke

Mark Profaca

Stephen John Sleijpen

David Bernardi

Julian Paul Kolodko

William John Stacey

Neil Fyfe Edwards

Toby Desmond Oste

James Andrew

Lance Thomas Brown

David Oliver Burke

Jason Mark Thelander

Jan Waszczuk

William Granger

Desmond Bruce Boyton

A suspended inkjet printing system includes: a pair of support beams extending across a media path; a mounting frame mounted between the support beams, a print head chassis mounted on the mounting frame, the print head chassis being actuable between at least a printing position and a maintenance position; and a plurality of print heads mounted on the print head chassis, each print head extending across the media path and spaced apart along the media path in a direction of media propagation. A plurality of projections extend from the print head chassis into engagement with the mounting frame, the projections controlling a height of the print head chassis relative to the media path.

Suspended inkjet printing system

A printing method includes the steps of: receiving a color image and separating the color image into a plurality of distinct color planes; dithering a first distinct color plane to obtain dot data for the first distinct color plane; dithering a second distinct color plane to obtain dot data for the second distinct color plane; providing the dot data for the first distinct color plane to a first print head cartridge for printing by a plurality of nozzle rows of the first print head cartridge; and providing the dot data for the second distinct color plane to a second print head cartridge positioned downstream from the first print head cartridge in a direction of print media propagation, the dot data for the second distinct color plane for printing by a plurality of nozzle rows of the second print head cartridge.

Method of providing delayed, shifted or reordered dot data to spatially separated printheads printing different color planes

An inkjet printing system includes: a plurality of print head cartridges; a print head chassis for supporting the plurality of print head cartridges; a lift mechanism for lifting and lowering the print head chassis between a printing position, a transition position, and a maintenance position; and a maintenance chassis supporting a chassis sub-frame having a corresponding plurality of maintenance cradles; and a sub-frame movement mechanism for slidably moving the chassis sub-frame with respect to the maintenance chassis. In the transition position, the print head chassis is held at a height, relative to a platen, that allows the maintenance chassis to be moved from a storage position to an operational positional under the print head chassis. Further, in the operational position, the sub-frame movement mechanism aligns a capper or a wiper with a respective printhead.

Inkjet printing system with manoeverable maintenance chassis

An inkjet printing system includes: a printer frame; a print head chassis mounted on the printer frame, the print head chassis supporting a plurality of print head cartridges, each print head cartridge having a longitudinal axis extending across a direction of print media propagation, each print head cartridge being spaced apart along the direction of print media propagation, and each print head cartridge having a respective monochrome inkjet printhead; a lift mechanism for lifting and lowering the print head chassis relative to the printer frame; and a plurality of ink blades slidably received in respective docking slots of the printer frame. Each ink blade includes a blade chassis and an ink reservoir mounted on the blade chassis, the ink reservoir being in fluid communication with a respective printhead.

Inkjet printing system with liftable print head chassis and slidable ink blades

A color ink printing system includes a plurality of print head cartridges each including a modular printhead made up of a plurality of print head tiles; a print head chassis for supporting the plurality of print head cartridges; and a maintenance chassis for supporting a plurality of maintenance cradles, the maintenance chassis is actuable between a storage position and an operational position. Each of the plurality of print head cartridges is held stationary with respect to a platen on which print media is propagated. Each print head cartridge is a monochrome print head cartridge ejecting a fluid different to the remaining print head cartridges. One or more of the plurality of print head cartridges includes a plurality of ventilation slits defined in the vicinity of the print head tiles, having applied thereto a suction force for sucking ink aerosol particles away from the print head tiles.

Multiple monochromatic print cartridge printing system

A colour ink printing system includes a plurality of print head cartridges, each extending across a direction of print media propagation and spaced apart along the direction of print media propagation; a print head chassis for supporting the plurality of print head cartridges, the print head chassis actuable between a printing position, a transition position, and a maintenance position; and a maintenance chassis for supporting a plurality of maintenance cradles, the maintenance chassis actuable between a storage position and an operational position. Each of the plurality of print head cartridges is held stationary with respect to a platen on which print media is propagated to effect printing on the print media. Each of the plurality of print head cartridges is a monochrome print head cartridge ejecting a fluid different to the remaining plurality of print head cartridges.

Multiple monochromatic print cartridge printing system and print alignment method

Multiple monochromatic print cartridge printing method separating distinct colour plane into plurality of fake colour planes to form fake colour image

The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice onto the carrier.

Placement head for a die placing assembly

A color ink printing system, includes a plurality of print head cartridges, each extending across a direction of print media propagation and spaced apart along the direction of print media propagation; a print head chassis for supporting the plurality of print head cartridges, the print head chassis actuable between a printing position, a transition position, and a maintenance position; a maintenance chassis for supporting a plurality of maintenance cradles, the maintenance chassis actuable between a storage position and an operational position; and a platen on which the print media is supported and propagated. Each of the plurality of print head cartridges is held stationary with respect to a platen on which print media is propagated to effect printing on the print media. Each of the plurality of print head cartridges is a monochrome print head cartridge ejecting a fluid different to the remaining plurality of print head cartridges.

A color ink printing system includes a plurality of print head cartridges, each extending across and spaced apart along a direction of print media propagation; a print head chassis for supporting the plurality of print head cartridges, the print head chassis actuable between a printing position, a transition position, and a maintenance position; a maintenance chassis for supporting a plurality of maintenance cradles, the maintenance chassis actuable between a storage position and an operational position; and a plurality of supporting arms respectively extending upwards from each corner of the print head chassis. Each of the plurality of print head cartridges is held stationary with respect to a platen on which print media is propagated to effect printing on the print media. Each of the plurality of print head cartridges is a monochrome print head cartridge ejecting a fluid different to the remaining plurality of print head cartridges.

The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.

Wafer positioning system

This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Integrated circuit placement system

The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

Clamp assembly for an assembler of integrated circuitry on a carrier

The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier.

Method of attaching integrated circuits to a carrier

The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Growing community of inventors

Balmain, Australia

Peter John Morley Sobey