University System of Maryland

Peter John Heim

Mario Dagenais

Scott A Merritt

Simarjeet S Saini

Robert Ernest Bartolo

Vijayanand Vusirikala

A resonant coupler has a coupling region having first and second ends, a coupling length, and a tapered variable width, such that a phase matching condition for the waveguide is met within the coupling length. In an exemplary embodiment the first and second ends each have a corresponding variable width which varies at a rate greater than the variable width of the coupling length. In yet another embodiment the coupling region has an electrically sensitive phase matching characteristic and an electrode in operative relation with the coupling region for varying the phase matching characteristic.

Resonantly coupled waveguides using a taper

A method and a resulting device for mounting a semiconductor to a submount by depositing a first layer of a first metal solder having a selected first melting point and corresponding thickness onto a surface of the semiconductor. Depositing a second layer of a second metal solder having a selected second melting point higher than the first melting point and a corresponding selected thickness onto a surface of the submount. Disposing the semiconductor surface and submount surface in confronting intimate contact and heating the submount and semiconductor to a temperature greater than the first temperature and lower that the second temperature for initiating and promoting liquid interdiffusion between the first and second solders.

Growing community of inventors

Washington, DC, United States of America

Peter John Heim