Sico Jena Gmbh Quarzschmelze

Qvf Pilot-tec Gmbh

Peter Jochmann

Edith Zimmermann

Klaus Sivec

Walter Nadrag

Wilfried Hupfer

Werner Schmid

Hans-Juergen Flieger

Dirk Schulze

Karl-Heinz Schiecke

Bernhart Sindzinski

A process for producing composite bodies from a plurality of molded pieces made from quartz materials of different or identical structure, preferably fused quartz and/or fused silica. Also, composite bodies produced according to this process. A prismatic molded piece with a rectangular bottom surface and top surface and four plate-shaped molded pieces whose dimensions are tailored to the outer surfaces of the prismatic molded piece are produced in a first step, the plate-shaped molded pieces are then fixed to the outer surfaces of the prismatic molded piece, the prismatic molded piece and the plate-shaped molded pieces are heated together under protective gas to a predetermined temperature T above the softening temperature of the quartz material and then cooled, resulting in a prismatic composite body which is joined thermally in a material engagement and which can be severed to form a series of plate-shaped composite bodies.

Process for producing composite bodies from quartz material

The invention relates to pressure-proof glass bodies (,) composed of two half-spheres (,) comprising or not a cylindrical intermediate part (,) and having complementary surfaces (,) which are brought into contact with each other, whereby the outer surfaces of a formed seam are even and flat. The glass elements are assembled in a non detachable way by gluing them together with a curable glue which is applied to said complementary surfaces. A glued seam (,) which is formed, for example, by a light or heat-curable glue, can be covered with a permanently elastic sealing material and then with a band and/or tape. The inventive glass bodies are characterized in that they are simple to manufacture and safe to operate when they are used in the oceanographic field.

Adhesively bonded pressure-resistant glass bodies

A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting semiconductor disks between different machining stations and which is formed of a plurality of individually pre-manufactured device parts that are assembled and connected with one another. The invention is further directed to a holding device for semiconductor disks which is manufactured by the production process according to the invention. In a process of the type described above, the device parts are first pre-manufactured separately and independent from one another from single-crystal or polycrystalline silicon and, in so doing, are provided with fitting surfaces which correspond to one another. The adjacent device parts with opposite fitting surfaces are then joined one inside or against the other and the fitting surfaces are connected with one another by diffusion welding and/or by soldering, wherein germanium powder is used as solder.

Process for the production of a holding device for semiconductor disks and holding device produced by this process

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Jena, Germany

Peter Jochmann