Lecroy Corporation

Teledyne Lecroy, Inc.

Nubis Communications, Inc.

Oracle International Corporation

Other

Peter James Pupalaikis

David C Graef

Peter Johannes Winzer

Clinton Randy Giles

Brett Michael Dunn Sawyer

Ron Zhang

Kaviyesh B Doshi

Guilhem De Valicourt

Lawrence W Jacobs

Anirudh Kailash Sureka

Roger Delbue

Michael G Hertz

Jonathan Proesel

Martin Miller

Anthony R Cake

Istvan Novak

Joseph M Schachner

Michael Schnecker

Laxmikant Joshi

Yaron Habot

William Driver

Stephen Mark Sekel

Robert Mart

Lukas Elsinger

Lawrence Steven Salant

Francois Lamarche

Stephen Ems

Simon Kreymerman

James Mueller

Gerald Juskovic

A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

Data processing systems including optical communication modules

A system includes a substrate on which a data processor and a connector block are mounted. The connector block has a first array of electrical connectors on a first surface, and a second array of electrical conducts on a second surface that is oriented at an angle between 45° to 135° relative to a main surface of the substrate. At least a portion of the first array of electrical connectors are electrically coupled to the data processor, and the second array of electrical contacts are electrically connected to the electrical contacts of a pluggable module. The pluggable module includes an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector.

Communication systems having pluggable modules

A method of assembling an optical device including: providing a photonic integrated circuit including a plurality of vertical-coupling elements disposed along a main surface of the photonic integrated circuit; attaching an optical subassembly to the photonic integrated circuit; removably connecting a fiber connector to a ferrule frame, in which the fiber connector is attached to an array of optical fibers; aligning the ferrule frame to the optical subassembly using an active alignment process; and securely connecting the ferrule frame to the optical subassembly after the active alignment process.

Optical fiber-to-chip interconnection

A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the co-packaged optical module to be coupled to the substrate.

Communication systems having co-packaged optical modules

A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

An apparatus includes a fiber-optic connector configured to be connected between one or more optical fibers having fiber cores and a photonic integrated circuit (PIC) including vertical-coupling elements. The fiber-optic connector includes a polarization beam splitter and a patterned birefringent plate. The polarization beam splitter splits an incident light beam from a fiber core into first and second beams having first and second polarizations, respectively. The patterned birefringent plate includes a first region (having a first optical birefringence) and a second region (having a second optical birefringence). The difference in the first and second optical birefringence is caused by (i) applying localized heating to the first region without applying localized heating to the second region to cause the first region to have a lower birefringence as compared to the second region, or (ii) applying different amounts of localized heating to the first and second regions to produce different birefringence.

Growing community of inventors

Ramsey, NJ, United States of America

Peter James Pupalaikis