Hewlett-packard Development Company, L.p.

Other

Hewlett-packard Company

Hewlett-packard Development, L.p.

Peter James Fricke

Andrew L Van Brocklin

Daryl E Anderson

Eric T Martin

James Michael Gardner

Andrew Koll

Kenneth Kay Smith

Scott A Linn

Kenneth James Eldredge

Adam L Ghozeil

James E Ellenson

Timothy D Emmerich

Warren Bruce Jackson

Alan R Arthur

Mark Hunter

Andrew L VanBrocklin

Frederick A Perner

Neal W Meyer

Sarah Morris Brandenberger

Dennis M Lazaroff

Michael W Cumbie

Kurt M Ulmer

Gregory J May

Tony S Cruz-Uribe

Ronald A Hellekson

David Maxfield

Joseph W Stellbrink

S Jonathan Wang

Roshan B Baliga

Luca Molinari

Janice H Nickel

James Richard Przybyla

Zhizhang Chen

Heon Lee

James E Clark

Silam J Choy

Arthur Piehl

P Guy Howard

Marshall Field

Darrel R Bloomquist

John A Devos

James Robert Eaton

David Punsalan

John M Da Cunha

Tim R Koch

Steven C Johnson

Judy Bloomquist, Legal Representative

Kenneth Michael Kramer

Richard Aufranc

Andy Van Brocklin

Ken Kramer

Jim Ellenson

David Pursalan

Andy Van Brockin

Andrew Lester Van Brocklin

Mark A Hunter

A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.

Apparatus with microelectromechanical die and application specific integrated circuit

In some examples, a fluid die includes a fluid nozzle, a first latch, a second latch, and a timing circuit comprising a counter and a comparator. The timing circuit is to trigger the first latch, at a first predetermined time instant from an edge of a firing pulse, to store a first test result obtained based on a voltage measured across the fluid nozzle, and trigger the second latch, at a second predetermined time instant from the edge of the firing pulse, to store a second test result obtained based on a voltage measured across the fluid nozzle.

Nozzle condition indication

An example device in accordance with an aspect of the present disclosure includes modules to generate an input signal, apply the input signal to an ink sample to obtain an ink signal, compare the ink signal to a reference value, and identify whether the ink signal is consistent with an ink signature. A module may be contained on an inkjet printhead die.

Modules to evaluate ink signals

In some examples, a printing system comprises a plurality of microelectromechanical systems (MEMS) dies comprising printing fluid jets, a printhead assembly (PHA) application specific integrated circuit (ASIC), and a substrate comprising the plurality of MEMS dies and the PHA ASIC. The PHA ASIC is to process image data into a plurality of data signals that define a firing pattern, and transmit the data signals through transmission lines on the substrate to the plurality of MEMS dies. The printing fluid jets of the plurality of MEMS dies are to fire in response to the data signals.

Printing system comprising a microelectromechanical die and an application specific integrated circuit

In some examples, a method of regulating a temperature of a printhead includes charging, in a first state of a temperature regulator, an analog memory to a reference voltage that corresponds to a predetermined temperature of the printhead. The temperature regulator monitors, during a second state, the temperature of the printhead, the monitoring including measuring a thermal voltage representing an actual temperature of at least a first local area of a plurality of local areas of the printhead, and comparing, with a comparator, the reference voltage to the thermal voltage to obtain a comparison result for at least the first local area. Based on the comparison result, a series of warming pulses from a warming pulse circuit to at least the first local area is selectively enabled.

Method and apparatus to regulate temperature of printheads

A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

Wide array printhead module

In an example, a print head comprises a nozzle to be activated by a delayed fire pulse that is delayed from an initial fire pulse, a sensor to measure an impedance of the nozzle, and a detector to determine a first time instant following the delayed fire pulse for registering a first impedance measurement by the sensor.

Impedance measurements at time instants

Printhead with microelectromechanical die and application specific integrated circuit

Accounting for oscillations with drop ejection waveforms can include identifying a previous ejection waveform having a first plurality of parameters including a time interval from a final pulse of the previous ejection waveform. Accounting for oscillations with drop ejection waveforms can include determining a second plurality of parameters based on the first plurality of parameters, where the second plurality of parameters define a current ejection waveform that accounts for oscillations caused by the previous ejection waveform. Accounting for oscillations with drop ejection waveforms can include applying the current ejection waveform to cause an ejection nozzle of the printhead to generate a desired fluid drop.

Accounting for oscillations with drop ejection waveforms

An apparatus including an analog memory, a temperature sensor, a comparator, and a pulse circuit. The analog memory is charged to a reference voltage corresponding to a predetermined temperature of a printhead. The temperature sensor measures a thermal voltage of at least one of the plurality of local areas of the printhead. The comparator obtains a comparison result by comparing the reference voltage to the thermal voltage. The pulse circuit selectively transmits a series of warming pulses to the at least one of the plurality of local areas of the printhead based on the comparison result.

In some examples, a piezoelectric fluid ejection assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles, a first application-specific integrated circuit (ASIC) die electrically connected to the MEMS die, and a second ASIC die electrically connected to the MEMS die. The first ASIC die includes a plurality of driver amplifiers for respective nozzles of a first number of the plurality of nozzles, and a plurality of unique waveform data generators to generate respective different waveforms for activating the nozzles of the first number of the plurality of nozzles.

Piezoelectric fluid ejection assembly

Systems and methods for evaluating the condition of a print nozzle are described. In one example, impedances across the print nozzle are measured. Subsequently, first test result and second test result are determined and registered at a first predetermined time instant and at a second predetermined time instant, respectively. The first test result and the second test result are obtained based on the measured impedances. Based on the first test result and the second test result, the condition of the print nozzle, is determined.

Evaluating print nozzle condition

In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles. An application-specific integrated circuit (ASIC) die is coupled to the MEMS die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles. An arbitrary data generator (ADG) on the ASIC is to provide a digital data sequence, and a multiplier is to scale multiple nozzles of the plurality of nozzles.

Piezoelectric printhead assembly with multiplier to scale multiple nozzles

In some examples, a piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies, and application-specific integrated circuit (ASIC) dies electrically connected to the piezoelectric MEMS dies.

Piezoelectric printhead assembly

In some examples, a printhead die includes a nozzle to be fired by a fire pulse, and a sensor to measure, during a firing of the nozzle by the fire pulse, a measured signal comprising an impedance characteristic of a fluid sample of the nozzle, in response to an input signal applied to the fluid sample. A comparator is to compare the measured signal to a reference value, and a counter is to count over an evaluation interval in response to the comparing indicating that an evaluation criterion is satisfied, and the counter is to stop counting in response to the comparing indicating that the evaluation criterion is not satisfied, a count value of the counter providing an indicator of nozzle chamber operation corresponding to the measured signal.

Modules to identify nozzle chamber operation

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Corvallis, OR, United States of America

Peter James Fricke