Cray Research, Inc.

Peter J Wehner

Delvin D Eberlein

Melvin C August

Richard R Steitz

David L Duxstad

David F Leonard

Paul M Knudsen

An alignment fixture for use in sealing integrated circuit packages including a body having rectangular alignment cavities therein for receiving components of integrated circuit packages. The body is inclined at an angle relative to a horizontal reference plane. The rectangular alignment cavities are rotated at 451/2 angle relative to a longitudinal axis of the body.

Self-aligned sealing fixture for use in assembly of microelectronic

A ceramic chip carrier package for integrated circuits is described which provides reduced interlead capacitance. A cavity for the placement of the integrated circuit chip is centrally located on a substrate. The leads of the package are bridged between the cavity and the outer periphery of the substrate. The leads are bonded to the substrate using adhesive glass placed on the substrate at the outer periphery of the cavity and at the outer periphery of the substrate. Sealing glass is placed on the outer periphery of the substrate over the leads to provide a bonding material for a lid to the package. The area between the cavity and the outer periphery of the substrate has no adhesive or sealing glass which thus provides an air dielectric between the leads so that interlead capacitance is reduced. In a second preferred embodiment, a channel is provided in the ceramic substrate between the periphery of the cavity and the periphery of the substrate to control the flow of adhesive glass and sealing glass so that the glasses do not migrate onto the leads. Since the air dielectric constant is lower than the glass dielectric constant, the interlead capacitance is lower than that found in prior art packages.

Reduced capacitance chip carrier

Improved performance and reliability is obtained in test sockets for integrated circuits (ICs). Sufficient over-travel is provided to prevent pinching when the IC and its carrier are inserted in the test socket and the lid is latched closed. A power operated piston applies controllable and uniform pressure to force the IC leads onto contact pins in the test socket base. This controllable and uniform pressure prevents gouged IC leads, bent test socket pins, and other damage that prevents proper electrical and mechanical contact between IC leads and contact pins resulting in erroneous indications of faulty IC operation.

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Eau Claire, WI, United States of America

Peter J Wehner