Texas Instruments Corporation

Peter J Sakakinl

Sean Michael Malolepszy

Thick film bond surfaces () on a support structure (), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit () having raised bosses () engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit () is fit within a clamp () that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder ().

Growing community of inventors

Frisco, TX, United States of America

Peter J Sakakinl