Kollmorgen Technologies Corporation

Peter J Oleske

John F McCormack

Michael A DeLuca

A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145.degree. and 240.degree. C. and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.

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Rocky Point, NY, United States of America

Peter J Oleske