Other

Peter J Normington

H Dan Higgins

Holder apparatus for holding an integrated circuit die for testing includes a carrier element for the die. The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder apparatus and the card's probe needles are biased against the die. Different embodiments of the holder apparatus are disclosed, including holder apparatus with a removable alignment plate and holder apparatus with an integral alignment plate, both of which embodiments secure the die to the bottom of the holder apparatus, and holder apparatus in which the die or chip is secured to the top of the holder apparatus. Probe card apparatus usable with the various holder apparatus embodiments includes needles which comprise continuations of traces on the probe card and which include trace elements which may be connected directly to test circuitry without intermediate socket connectors.

Die carrier apparatus

Leadframes from a TAB tape having die attached are curved and the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make the stack. Sides having an array of conductive contact areas connected in a predetermined pattern are placed against the edges of the die to touch the curved leads which form a resilient contact with the sides. A resilient member is located within the curved leads to support the leads during assembly. In one embodiment, the leads are wrapped around the edges of the die itself. In other embodiments, the leads are wrapped around the edge of the separator. A first construction of the stack facilitates assembly of the stack from the bottom up and a second construction facilitates assembly of the stack from the top down.

Semiconductor device including stacked die

Leadframes from a TAB tape having die attached are curved so that the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make the stack. Sides having an array of conductive contact areas connected in a predetermined pattern are placed against the edges of the die to touch the curved leads which form a resilient contact with the sides. A resilient member can be located within the curved leads to support the leads during assembly. In one embodiment, the leads are wrapped around the edges of the die itself. In other embodiments, the leads are wrapped around the edge of the separator.

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Gilbert, AZ, United States of America

Peter J Normington