Xerox Corporation

Peter J John

Gary Alan Kneezel

Joseph F Stephany

Joseph J Wysocki

Thomas E Watrobski

Richard V LaDonna

Juan J Becerra

Almon P Fisher

Timothy J Fuller

Steven Robert Moore

William G Hawkins

Ram S Narang

William R Burger

Herman A Hermanson

Thomas P Courtney

James N Eaton

Michael Lo

Bobbie A Rice

An apparatus ( ) for filtering a substance ( ) includes an electrically insulating substrate ( ) that separates a source volume ( ) containing the substance ( ) from a target volume ( ). The substrate ( ) has a first side in fluid communication with the source volume ( ) and a second side in fluid communication with the target volume ( ). The substrate ( ) further includes a plurality of openings ( ) connecting the first side with the second side. The openings ( ) are sized to provide filtering fluid communication between the source volume ( ) and the target volume ( ) for at least one phase of the substance. A heater film ( ) is deposited over selected portions of the substrate ( ). The heater film ( ) contacts the substrate ( ) to heat at least a portion of the openings ( ).

Filter with integral heating element

A method of fabricating a printhead for use in an ink jet printing device which includes providing a substrate having at least one substantially planar surface. An array of heating elements are formed on the surface of the substrate and addressed with a current pulse from an electrode. Depositing an insulating layer over the surface. Next, the insulating layer is mechanically or chemically treated to expose the heating elements. An ink channel plate is formed and includes at least one ink reservoir and one ink channel. A key or keyway is formed on channel plate and a corresponding key or keyway is formed on the insulating layer. The said channel plate is then adhesively secured to the substrate using the key and keyway as an alignment aid to achieve proper positioning of the ink channels and the heating elements.

Ink jet printhead and method for its manufacture

Disclosed is an apparatus which comprises at least one semiconductor chip mounted on a substrate, said substrate comprising a porous, electrically conductive member having electrophoretically deposited thereon a coating of a polymeric material. In one embodiment, the semiconductor chips are thermal ink jet printhead subunits.

Stabilized porous, electrically conductive substrates

An ink jet printhead is disclosed which has improved printhead cooling thereby improving operating efficiency. The printhead is constructed so that the manifold bringing ink from an ink reservoir into an ink inlet to the printer directly contacts the thermally conductive surface of the substrate in which the heater elements are formed- The cooler ink removes some of the accumulated heat from the heater substrate and is subsequently ejected. In one embodiment the printhead comprises an upper channel substrate which is bonded to a lower heater substrate which is formed with a ledge which extends past the rear face of the channel substrate. The channel substrate has an ink inlet formed into its rear face and adjacent to an extended portion of the heater silicon surface. An ink reservoir brings ink to the printhead via an ink manifold which is sealed against the exposed silicon surface and against the side of the ink inlet. In a second embodiment, the formation of an ink inlet at the rear face enables the construction of a compact multicolor sideshooting printhead with 2 rows of nozzles.

Ink jet printhead with improved operation

An ink jet printbar assembly is provided with a plurality of printhead die assemblies mounted on a single flat substrate. The printhead die assemblies are linearly aligned along the substrate length. Each die assembly includes a line of nozzles having the same active print length. The individual die assemblies are spaced from adjacent die assemblies such that the last functional nozzle on one end of a die assembly is spaced a distance which is less than the active print length from the first adjacent functional nozzle on the next adjacent die assembly.

Multiple die assembly printbar with die spacing less than an active

Individual printheads are joined together in a manner to provide improved alignment and registration. The multiple printhead assembly is then installed and removed from the printer as a single unit. According to a preferred method of forming the assembly, individual printheads are temporarily mounted on a holddown plate. The location and position of the printheads is monitored and a fast-cure adhesive used to monolithically join the individual printheads together as a unitary assembly. Once the adhesive is cured, the temporary securing of the individual printheads is removed and the entire assembly removed as a single unit from the holddown plate.

Monolithic printheads for ink jet printing apparatus

A control system for a printer having at least one heating element for producing spots applies one of a plurality of voltage levels to at least one heating element disposed on a printhead. A voltage supply supplies a voltage to a first one of a plurality of switches connected in series with a last one of the switches being connected to the at least one heating element. At least one of the switches defines a first path and a second path having different voltage drops. A controller coupled to the plurality of switches selectively actuates the switches to apply one of a plurality of predetermined voltages to the at least one heating element.

Power control system for a printer

An apparatus and method compensates for a voltage drop of electrical pulse signals selectively applied to a plurality of heater elements on a printhead of an ink jet printing device. A number of heater elements to be pulsed at a given time is determined and a time duration of each of the pulse signals is selected based on information including the determined number of heater elements to be pulsed. In another aspect, the position on the printhead of the heater elements to be pulsed is determined and the time duration of the pulse signals is selected further based on the determined position. By varying the time duration of the pulse signals applied to the heater elements, a voltage drop across the heater elements due to the number of heater elements simultaneously pulsed and/or the position of the heater elements on the printhead is compensated for, maintaining reliable jetting performance while minimizing the voltage by which operating printing voltage needs to exceed the threshold printing voltage.

Voltage drop correction for ink jet printer

A printhead with a printhead die, an ink manifold and heat sink substrate has a continuous sealing surface surrounding the printhead die which is formed by the ink manifold, heat sink substrate and filler material disposed therebetween. The filler material acts as caulking to eliminate gaps around the printhead die, particularly between the ink manifold and heat sink substrate, and to provide a smooth surface for abutment with a capping member. A fluid-tight seal is obtained between the capping member and the continuous sealing surface on the printhead, thus preventing the drying out of ink in the nozzles through evaporation of volatile ink components. In some priming nozzle configurations, the leaktight seal also facilitates priming of the printhead.

Moisture leakage resistant capping surface for ink jet printhead

A one-step process bonds a manifold to a printhead die and interconnection board located on a heat sinking substrate, encapsulates wire bonds extending from the interconnection board and the printhead die, and seals air gaps between the manifold and printhead die. A through hole is made in the heat sink substrate and communicates with a cavity defined by the manifold. During assembly, the manifold is positioned on top of the substrate containing the printhead die and the interconnection board and retained by pins. An encapsulation fluid is injected from an underside of the substrate through the through hole and into the cavity. Injection is stopped when the fluid flows nearly to the front of the printhead. The process provides encapsulation of wire bonds, sealing of any air gap between the manifold and the printhead along a front face, and enhances structural bonding of the manifold to printhead components.

Growing community of inventors

Rochester, NY, United States of America

Peter J John