Basf Aktiengesellschaft

Basf Se Corporation

Peter Hoessel

Gerhard Hoffmann

Juergen Langen

Son Nguyen-Kim

Thomas Wuensch

Axel Sanner

Hartmut Hibst

Maximilian Angel

Klaus Harth

Son Nguyen Kim

Dieter Faul

Klemens Mathauer

Hans Schupp

Claudia Wood

Helga Gondek

Karin Sperling-Vietmeier

Helmut Lehmann

Klaus Wilhelm Lienert

Lysander Chrisstoffels

Walter Schunter

Gabi Mueller

Annette Mehling

Holger Reinecke

Heidi Riedel

Jan Peter Koch

The invention relates to a cosmetic product containing at least one water-soluble copolymer which is obtained by radical copolymerization of acrylamide and/or methacrylamide and other water-soluble a,&#x3b2;-ethylenically unsaturated compounds which are copolymerizable therewith, optionally in the presence of a water-soluble polymeric graft base.

Cosmetic product comprising at least one water-soluble copolymer which contains (meth)acrylamide units

The present invention relates to a cosmetic composition which comprises at least one water-soluble or water-dispersible copolymer which is obtainable by free-radical copolymerization of at least one N-vinyllactam, at least one anionogenic monomer and optionally further &#x3b1;,&#x3b2;-ethylenically unsaturated compounds copolymerizable therewith, in the presence of a polymer component with repeat units which have ether groups or which are derived from vinyl alcohol.

Cosmetic agent containing at least one copolymer having N-vinyllactam units

Use of cationic polyurethanes and polyureas as ingredients of cosmetic preparations

The invention relates to a process for producing microstructure elements having structure depths of from several .mu.m to the mm region by imagewise irradiation of polymers with X-rays, where the polymers employed are aliphatic polyesters.

Production of microstructure elements

A process for the production of micromoldings having a high aspect ratio by imagewise irradiation of a polymer with high-energy, parallel radiation from an X-ray source employs, as the polymer, a homo- or copolyoxymethylene.

Production of micromoldings having a high aspect ratio

A process for producing a polymer/metal or polymer/semiconductor composite having an adhesive layer between the polymer and the metal or between the polymer and the semiconductor in which a layer of at least two different chemical elements is applied to the metal or semiconductor by vapor-deposition or cathode sputtering, then selectively or partially removing at least one chemical element of this layer in an etching process, and then applying the polymer.

Production of a polymer/metal or polymer/semiconductor composite

A process for the production of microstructure elements having structure depths of from several .mu.m into the mm range by imagewise irradiation of polymers with X-rays and removal of the areas of the polymers which have been irradiated imagewise, comprises applying the polymers, before the imagewise irradiation, to an electroconductive substrate in a layer thickness of from several .mu.m into the mm range by melting under pressure, thus firmly anchoring the polymers. The process according to the invention is particularly suitable for the production of microstructure elements having structure depths of from 3 to 2000 .mu.m and lateral dimensions of less than 10 .mu.m.

A process for the production of micromoldings having a high aspect ratio by imagewise irradiation of a polymer with high-energy, parallel radiation from an X-ray source employs, as the polymer, a copolymer comprising SO.sub.2 and one or more ethylenically unsaturated organic compounds.

Self-bonding enamel solution for heat-resistant coatings

Growing community of inventors

Schifferstadt, Germany

Peter Hoessel