Sauer Gmbh Lasertec

Sauer Gmbh

Lasertec Gmbh

Other

Maho Aktiengesellschaft

Dmg Mori Ultrasonic Lasertec Gmbh

Peter Hildebrand

Martin Reisacher

Michael Kuhl

Gottfried Reinicke

Peter Wrba

Karl-Hermann Richter

Gunter Eberl

Udo Stürmer

Josef Neumaier

Alfons Eiterer

A method for machining at least one workpiece surface to apply a texture pattern to at least one section of the workpiece surface using a laser, based on image data specifying an image of the texture pattern applied to the at least one section of the workpiece surface and model data specifying a three-dimensional geometry of a surface form corresponding to the at least one section of the workpiece surface. Control data and segment data are generated based on the image and model data. The control data specify one or more segment sequences for each track line. Each segment sequence has track segments where the laser guides the texture pattern application to the at least one section of the workpiece surface; wherein the track segments of a segment sequence include one or more laser track segments where the laser travels in the switched-on state at a constant machining setpoint speed.

Method for machining a workpiece surface by means of a laser

The invention relates to a method for machining a multi-layer workpiece blank () by means of a laser beam, comprising the following steps: specifying a machining program for machining the workpiece blank according to an ablation geometry in order to generate a desired edge and/or surface geometry () using a laser machining device; tensioning the workpiece blank in the laser machining device and positioning the workpiece holder in a measuring position; measuring a thickness of at least one of the layers of the multi-layer workpiece blank (); modifying the machining program in order to machine the multi-layer workpiece blank () according to the measured layer thickness with an consistent ablation geometry; and machining the tensioned workpiece blank () using the modified machining program via a laser of the laser machining device in order to generate the desired edge and/or surface geometry () with a cutting edge (). The invention also relates to a correspondingly configured device.

Method for machining a cutting insert and corresponding device for machining a cutting insert

The invention relates to a machine tool () comprising a machine controller (), a machine frame (), a work table (), a tool holder (), preferably of a standardized design, multiple translational and/or rotational axes () for adjusting the relative position of the work table () and the work holder (), a tool magazine () for one or more material-removing, in particular machining tools (), a tool-change mechanism for automatically transporting tools between the tool holder () and the tool magazine (), a deposit-welding head () that can be inserted into the tool holder () and a storage device () for storing the deposit-welding head outside the tool holder ().

Machine tool, measurement apparatus, method for generating working data, cladding method, method for setting temperature of a workpiece

In a method for machining a workpiece by a pulsed laser beam emanating from a tool head, the pulsed laser beam is guided across the workpiece surface in a constant relative position between workpiece and tool head, and the workpiece is machined consecutively in a first and another second relative position. The operating parameters in the second relative position are controlled such that one or more laser pulse hit locations generated in the second relative position have a defined position with reference to one or more laser pulse hit positions generated from the first relative position, particularly lie in a one- or two-dimensional grid defined by plural laser pulse hit positions on the workpiece surface made from the first relative position.

Method for machining a workpiece by a laser beam, laser tool, laser machine, machine controller

A method for machining a workpiece by means of a laser beam, in which material of the workpiece is removed layer-by-layer according to predetermined definitions to produce a workpiece by traversing the exposed workpiece surface in lengths across the entire surface with a laser beam in order to vaporize and/or combust workpiece material. In a first material removal phase, the laser beam is guided relative to the workpiece over the workpiece surface by adjustable mirrors inside the laser tool, more particularly without mechanical control axes being moved to adjust the relative position between the laser tool and the workpiece. In a second material removal phase, the laser beam is guided relative to the workpiece over the workpiece surface by means of one or more control axes of the machine, the focal length being variably adjustable by means of a variable optical unit.

Method and device for machining a workpiece, more particularly for producing cutting tools

In a method for machining a workpiece, a laser beam () is guided across the workpiece surface by means of a beam guide (), wherein the laser beam guide comprises a first guide () effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide () simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Method and device for machining a workpiece

The invention relates to a method for producing a swaging in a workpiece, wherein a laser beam is guided through a beam guide over the surface of the workpiece in order to produce said swaging. The focal position of the laser beam is controlled in such a way that it can be varied at least temporarily in depth direction of the swaging. A device for the production of a swaging () in a workpiece () has a laser light source () for producing a laser beam for removing material, a focus adjustment device () for adjusting the focal position of the laser beam, a beam guide () for guiding the laser beam () over the surface of the workpiece and a control device () for controlling the focus adjustment device () and the beam guide (). The control device is designed to control the focal position of the laser beam by means of the focus adjustment device () at least temporarily to variable values in depth direction of the swaging.

Method and device for the production of a swaging

The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

A method for workpiece levelling includes mounting the workpiece in a machine tool, measuring the position of the workpiece in the mounting and determining a translatory offset xv, yv, zv and a rotatory offset &#x3bb;v, &#x3b2;v, &#x3c6;v of the factual workpiece mounting compared to the ideal mounting from the measurement results and from a workpiece data forming an initial data set related to the ideal mounting, wherein for obtaining another initial data set a plurality of surface points of the mounted workpiece are measured in their position xn, yn, zn in space, the data of one of the initial data sets are varied a plurality of times in accordance with plural translatory and rotatory displacements for obtaining a plurality of varied data sets, from the varied data sets and their base data set the one data set is determined that represents a surface with a lowest deviation measure compared to a surface represented by the other of the initial data sets, and the translatory offset xv, yv, zv and the rotatory offset &#x3bb;v, &#x3b2;v, &#x3c6;v is determined from the translatory and rotatory displacement of the determined data set.

Method and device for the initial measurement of a workpiece, and the processing of a workpiece

Disclosed is a laser machining apparatus comprising a workpiece fixture for fastening a workpiece, a first laser removing device for machining a workpiece using first operating parameters, and a second laser removing device which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Laser machining apparatus and laser machining method

During the production of a swage in a workpiece in which material is removed in layers by means of a laser beam the side walls of the swage are processed by means of a laser beam and/or a processing means and/or ultrasonic waves.

Method and device for producing a cavity in a workpiece

According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (x, y) for the removal of a layer (S) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Depth measurement and depth control or automatic depth control for a hollow to be produced by a laser processing device

A method of removing substance from the surface of a workpiece in which the removal of substance is effected layer-wise by irradiating a working site on the workpiece surface with a laser beam from a working head, the layer-wise removal of substance being carried out with the aid of a laser guidance guiding the laser across the surface of the workpiece within a working area predetermined by the apparatus, comprises positioning steps in which, after the start of the substance removal, the relative position of the workpiece and the working head are changed in accordance with a first and/or second criterion and adjusted so that a boundary of the working area comes to be disposed on different sections of the workpiece surface for identical working sites.

Method and apparatus for removing substance from the surface of a workpiece

The invention relates to a method of producing an aperture in a metallic component, in which the aperture comprises, at least in certain portions, a non-cylindrically formed funnel, extends from a first surface to a second surface of a component wall and is formed by a laser beam. The invention improves the dimensional accuracy and reduces the roughness of the surface of the aperture and/or funnel in that, by appropriate choice of the laser parameters, the metal is predominantly removed by sublimation during the formation of the funnel and the funnel is formed by laser removal of layers of a substantially constant thickness.

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Pfronten, Germany

Peter Hildebrand