Robert Boschgmbh

Bosch Corporation

Peter Hein

Frank Fischer

Eckhard Graf

Horst Muenzel

Jochen Franz

Matthias Illing

Henrik Siegle

Frank Henning

Martin Schoefthaler

Detlef Gruen

Helmut Skapa

A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.

Micromechanical cap structure and a corresponding production method

The present invention relates to a method for producing a GMR structure in which a metallic multiple layer is applied onto a carrier and in which the metallic multiple layer is patterned to produce the GMR structure, the carrier having a structure before the metallic multiple layer is applied and the patterning of the metallic multiple layer is performed by CMP. The present invention also relates to a GMR structure having a carrier and a patterned metallic multiple layer positioned on the carrier, the patterned metallic multiple layer being situated in one or more depressions of the carrier. In addition, the present invention relates to a use of GMR structures.

Giant magnetoresistance structure

A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 &#x3bc;m, which may in particular be in the range of 300 nm to 50 &#x3bc;m.

Micromechanical component as well as a method for producing a micromechanical component

A method for manufacturing a micromechanical component, that has at least one hollow space and a functional element that is provided at least partially in the hollow space and/or a functional layer that is provided at least partially therein, and a micromechanical component that is manufactured in accordance with the method, are described. To reduce manufacturing costs, the functional element and/or the functional layer is provided with a first protective layer at least in an area that directly or indirectly borders on a first sacrificial layer, which temporarily occupies the space of the hollow space that is subsequently formed in one or a plurality of etching steps, the material of the first protective layer being selected such that at least one etching process and/or etching medium, which etches or dissolves the first sacrificial layer, either does not substantially attack the first protective layer or does so only at a reduced etching rate in comparison to the first sacrificial layer.

Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method

A micromechanical structure and a corresponding manufacturing method. The structure includes a substrate, which includes an anchoring device, and a centrifugal mass, which is connected to the anchoring device via a flexible spring device, so that the centrifugal mass is elastically deflectable from its rest position. The centrifugal mass includes clearances and is configured to be deflectable by etching a sacrificial layer underneath it. The sacrificial layer is present in a first area located underneath the centrifugal mass with a first etchable thickness, and in a second area located underneath the centrifugal mass with a second etchable thickness, the second thickness is greater than the first thickness. The centrifugal mass is structured in the first area so that in etching only a maximum of two etching fronts may come together in order to limit the etching residue deposits.

Micromechanical structure, in particular for an acceleration sensor or yaw rate sensor and a corresponding method for producing the same

A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer beneath the movable element is removed so that the movable element becomes movable. After removal of the sacrificial layer, a protective layer is deposited on a surface of the movable element. Silicon oxide and/or silicon nitride is used for the protective layer.

Growing community of inventors

Reutlingen, Germany

Peter Hein