Magnecomp Corporation

Peter Hahn

Kuen Chee Ee

Long Zhang

David Glaess

Christopher G Dunn

Wei Keat Chai

Keith Allan Vanderlee

Christopher Schreiber

Steve Misuta

Johnathan Phu

Shijin Mei

Brett Holaway

Benjapa Tanampee

Amornrat Jaturawit

Markus Erwin Mangold

Arshad A Alfoqaha

Preecha Sudachun

Chu Wong

Shahyar Ziaei

Keith Hong

Jatuporn Nakarpha

Markus E Mangold

An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure. At least one depression feature can be implemented on top of the electrical connection structure to constrain the epoxy and the at least one conductive component.

Contact pad with electrical connection structure for connecting a piezoelectric element and an electrical circuit with a conductive adhesive

A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer thereby reducing or eliminating bending of the assembly as installed in an environment, thereby increasing the effective stroke length of the assembly. Poling only a single layer would induce stresses into the device; hence, polling both piezoelectric layers even though only one layer will be active in use reduces stresses in the device and therefore increases reliability.

Multi-layer PZT microactuator having oppositely poled PZT constraining layer

A multi-level piezoelectric actuator is manufactured using wafer level processing. Two PZT wafers are formed and separately metallized for electrodes. The metallization on the second wafer is patterned, and holes that will become electrical vias are formed in the second wafer. The wafers are then stacked and sintered, then the devices are poled as a group and then singulated to form nearly complete individual PZT actuators. Conductive epoxy is added into the holes at the product placement step in order to both adhere the actuator within its environment and to complete the electrical via thus completing the device. Alternatively: the first wafer is metallized; then the second wafer having holes therethrough but no metallization is stacked and sintered to the first wafer; and patterned metallization is applied to the second wafer to both form electrodes and to complete the vias. The devices are then poled as a group, and singulated.

Method of manufacturing a multi-layer PZT microactuator using wafer-level processing

A piezoelectric actuator assembly is described. The assembly including a first layer including a top and a bottom surfaces. The assembly including a second layer having a top and a bottom surfaces, the bottom surface of the second layer is disposed over the top surface of the first layer. The assembly including a third layer having a top and a bottom surfaces, the bottom surface of the third layer is disposed over the top surface of the second layer. The assembly includes a first electrode, a second electrode, a third electrode, and a fourth electrode. The third electrode is configured to be shorter than the second electrode such that the active PZT length of the second layer and the third layer is shorter than the active PZT length of the first layer.

Multilayer PZT electrode configuration for suspension stroke increase

A method of manufacturing a tri-stage assembly is described herein. The method includes attaching a first microactuator and a second microactuator to a trace gimbal to a flexure during a PZT on flexure process (POF). The first microactuator is located at a distal end of the flexure and the second microactuator located at a proximal end of the flexure. The method also includes welding the trace gimbal to a baseplate, and a load beam to secure the trace gimbal including the first microactuator and the second microactuator.

Tri-stage design for actuator attachment on flexure

A PZT microactuator such as for a hard disk drive has a restraining layer bonded on its side that is opposite the side on which the PZT is mounted. The restraining layer comprises a stiff and resilient material such as stainless steel. The restraining layer can cover most or all of the top of the PZT, with an electrical connection being made to the PZT where it is not covered by the restraining layer. The restraining layer reduces bending of the PZT as mounted and hence increases effective stroke length, or reverses the sign of the bending which increases the effective stroke length of the PZT even further. The restraining layer can be one or more active layers of PZT material that act in the opposite direction as the main PZT layer. The restraining layer(s) may be thinner than the main PZT layer.

Multi-layer PZT microactuator with active PZT constraining layers for a DSA suspension

A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

Method of manufacturing piezoelectric microactuators having wrap-around electrodes

An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure.

Contact pad features

A tri-stage actuated disk drive suspension is described. The tri-stage actuated disk drive suspension including a beam and a gimbal attached to the beam. The gimbal is configured to receive a first actuator to mount on a first surface of the suspension near a first lateral side of the suspension and is configured to receive a second actuator to mount on the first surface of the gimbal near a second lateral side of the suspension. The gimbal is configured to receive a head slider to mount on the first surface of the suspension. And, the tri-stage actuated disk drive suspension including a baseplate having the beam attached thereto. The baseplate configured to receive a third actuator from the first surface of the suspension to mount on a pair of shelves.

Disk drive suspension tri-stage actuator with single side actuator attach

A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer.

Manufacturing method for multi-layer PZT microactuator having a poled but inactive PZT constraining layer

A multi-layer microactuator for a hard disk drive suspension includes a piezoelectric ('PZT') layer, a constraining layer, a lower electrode layer, a middle electrode layer, and an upper electrode layer. The lower electrode layer is on a bottom surface of the PZT layer and includes a first lower electrode island, a second lower electrode island, and a third lower electrode island. The second lower electrode island includes a finger extending from a main body portion towards a first end of the PZT layer. The middle electrode layer is disposed between a top surface of the PZT layer and a bottom surface of the constraining layer. The middle electrode layer including a first middle electrode island and a second middle electrode island, the second middle electrode island including a finger extending from a main body portion towards the first end of the PZT layer.

Multi-layer microactuators for hard disk drive suspensions

Multi-layer PZT microacuator with active PZT constraining layers for a DSA suspension

A dual stage actuated suspension has a first piezoelectric microactuator on the trace gimbal assembly (TGA), and a pseudo feature located laterally opposite the microactuator. The pseudo feature is formed integrally with the TGA from at least one of the base metal layer, the insulative layer, and the conductive layer that make up the TGA. The pseudo feature helps to balance the suspension. The suspension can optionally have a second microactuator located proximal of the first microactuator in order to perform coarser positioning than the first microactuator, such that the suspension is a tri-stage actuated suspension.

Disk drive suspension tri-stage actuator having pseudo feature integrally constructed on trace gimbal

A method of assembly a dual stage actuated suspension includes either applying an adhesive to a microactuator motor and then B-staging the adhesive, or applying an adhesive that has already been B-staged such as in film adhesive form to the microactuator then assembling the microactuator into a suspension and then finishing the adhesive cure. The adhesive can be applied to bulk piezoelectric material, with the adhesive being B-staged either before or after it is applied to the bulk piezoelectric material, and the piezoelectric material then singulated into a number of individual piezoelectric microactuators. The method allows greater control over how much adhesive is used, and greater control over spread of that adhesive and control over potential contamination, than traditional liquid epoxy dispense methods.

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Wildomar, CA, United States of America

Peter Hahn