Kavlico Corporation

Custom Sensors & Technologies, Inc.

Peter H Seesink

Omar Abed

Robert D Hunter

Horst Obermeier

Calin Miclaus

Dan Rodriguez

Described herein is the sense element assembly for a capacitive pressure sensor and method for creating same that has increased sensitivity despite the parasitic capacitance that is created. The capacitive sensor element assembly, comprises a first semiconductive layer, and a first conductive layer, a first dielectric layer into which a cavity has been formed, the dielectric layer lying between the first semiconductive layer and the first conductive layer, wherein an electrical connection is made to the second conductive layer. A preferred method for fabricating a capacitive sensor assembly of the present invention comprises the steps of forming a dielectric layer on top of a conductive handle wafer; creating at least one cavity in the dielectric layer, bonding a thin semiconductive layer to the dielectric layer and connecting an operational amplifier to the input of the capacitive sensor assembly to overcome the parasitic capacitance formed during fabrication.

Backside controlled MEMS capacitive sensor and interface and method

Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.

Cointegrated MEMS sensor and method

A method is disclosed for providing calibration of sensor signals in a sensor having a measuring sensor and a reference sensor. The method includes receiving a sensor signal and a reference signal from the measuring sensor and the reference sensor, respectively. The method further includes providing a first compensation signal to the sensor signal based on a gain characteristic and providing a second compensation signal to the reference signal based on the gain characteristic and an offset characteristic; combining the first compensation signal and the sensor signal, and the second compensation signal and the reference signal to create a compensated sensor signal; and, adjusting the compensated signal for temperature effects by coupling a component having a high thermal coefficient to the sensor. An apparatus is also described herein.

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Ouddorp, Netherlands

Peter H Seesink