Siemens Aktiengesellschaft

Peter Gulde

Christian Scholz

A copper and/or permalloy layer is structured by means of dry etching. A layer of tantalum is applied as a mask to a layer to be structured, and a photoresist layer is applied to the tantalum layer. Subsequently, the structure of the photoresist layer generated in a photolithographic manner is transferred onto the mask by reactive ion etching. This procedure is continued until the copper or permalloy layer to be structured is exposed. The structuring of the copper or permalloy layer then occurs by ion beam etching.

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Berlin, Germany

Peter Gulde