Cambridge Enterprise Limited

Peter Griffin

Rachel A Oliver

Tongtong Zhu

Yingjun Liu

A method for etching a semiconductor structure () is provided, the semiconductor structure comprising a sub-surface quantum structure () of a first III-V semiconductor material, beneath a surface layer () of a second III-V semiconductor material having a charge carrier density of less than 5×10cm. The sub-surface quantum structure may comprise, for example, a quantum well, or a quantum wire, or a quantum dot. The method comprises the steps of exposing the surface layer to an electrolyte (), and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure () to form a plurality of nanostructures, while the surface layer () is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.

Method for electrochemically etching a semiconductor structure

A method for etching a semiconductor structure () is provided, the semiconductor structure comprising a sub-surface quantum structure () of a first III-V semiconductor material,beneath a surface layer () of a second III-V semiconductor material having a charge carrier density of less than 5&#xd7;10cm. The sub-surface quantum structure may comprise, for example, a quantum well, or a quantum wire, or a quantum dot. The method comprises the steps of exposing the surface layer to an electrolyte (), and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure () to form a plurality of nanostructures, while the surface layer () is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.

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Cambridge, United Kingdom

Peter Griffin