L2 Drive Inc.

Plasma-therm Nes LLC

Peter Goglia

Karim Kaddeche

John Wang

Vincent Lee

Sarpangala Hariharakeshava Hegde

The present invention relates to the field of controlling tape drive magnetic head spacing and the use of hard disk drive heads in a tape drive. The present invention is related to magnetic tape data storage and tape recorders that include components designed to minimize or eliminate head-to-tape contact to reduce or eliminate wear and contamination of the tape and the magnetic heads. Methods and apparatus of the present invention may control the head-to-media spacing by moving locations of magnetic heads relative to a tape. Such apparatus may include components designed to minimize magnetic spacing. This may be accomplished using actuators that move magnetic heads, or that move both magnetic heads and the tape of a tape drive. This may include supporting a back surface of the tape. The movement of the tape past the magnetic heads may be performed using mechanisms that contact and drive the back surface of the tape.

Active spacing control for contactless tape recording

The present invention relates to the field of tape drives, tape transport, tape heads and tape head suspension. More particularly, the present invention is related to magnetic tape data storage and tape recorders that include components designed to minimize or eliminate head-to-tape contact to reduce or eliminate wear and contamination of tape drive heads. Methods and apparatus of the present invention may dynamically control the head-to-media spacing by moving locations of magnetic heads relative to a tape. Such apparatus may include components designed to minimize magnetic spacing. This may be accomplished using actuators that move the magnetic heads, that move the tape, or that move both the magnetic heads and the tape. This may include supporting a back surface of the tape. Alternatively, or additionally, the movement of the tape past the magnetic heads may be performed using mechanisms that contact and drive the back surface of the tape.

A planetary arm coupled to a tilt actuator moves a wafer in oscillatory motion along an arcuate path to expose a surface of the wafer to an incident ion beam for deposition and/or etching processing of thin film structures on the surface of the wafer. A wafer holder on an end of the planetary arm may be driven in rotation while the planetary arm executes oscillatory motion at a selected tilt angle relative to an incident ion beam. A slit support plate provides controllable exposure of the wafer to the incident beam. Embodiments are suitable for use in wafer deposition machines and/or wafer etching machines.

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Alamo, CA, United States of America

Peter Goglia