Motorola Corporation

Peter Gibson Goolsby

Lei Ping Lai

Mark Weiss

Dan R Ramirez

In a selective soldering machine (FIG. ), a calibration circuit board (FIG. ) makes contact with a solder wave (FIG. ). The calibration circuit board ( ) is interfaced with a desktop computer unit (FIG. ) through a optoisolator unit (FIG. ). The desktop computer unit ( ) records which of the contact points (FIG. ) distributed on the calibration circuit board ( ) come into contact with the solder wave ( ). This data is then used to establish the solder contact area (FIG. ) as a function of the various parameters of the selective soldering machine ( ). These parameters include the flow rate and flow pressure of solder from the solder pot, the angle of inclination of the electronics board (FIG. ), the speed of the solder pump ( ), the distance from the leads ( ) to the solder wave ( ), the motion vector which a gantry ( ) applies to the electronics board ( ), and any preheating which may be applied the electronics board ( ).

Method and system for selective soldering process characterization

A method and apparatus for plating metals which delivers a voltage pulse with the possibility of a widely varying current magnitude characteristic to a plating electrode and an object having a large electrical reactance in terms of a parallel resistance and capacitance in order to raise the voltage potential between the electrode and an object to a programmed plating voltage overpotential and underpotential. The programmed plating voltage overpotential determines how fast the electrochemical reaction is allowed to proceed in the diffusion layer, and the programmed voltage underpotential determines how quickly the electrochemical reaction of the diffusion layer will slow down.

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Phoenix, AZ, United States of America

Peter Gibson Goolsby