Lucent Technologies Inc.

Peter Giannoglou

Christopher F Zappala

John Stanley Rucki

Alexander Petrunia

Nandakumar G Aakalu

Philip J Hubbauer

Steven C Andry

Woodly Maurice

Alfred F Miller

A multi-layer backplane for processing radio frequency (RF) and other signals has alternating layers of conductive traces for RF signals and other types of signals, and ground plane layers of conductive material electrically insulated from each other. The backplane upper layer has a plurality of coaxial connectors for connection of cables and other devices which supply RF energy signals to and convey them from the backplane, with each connector having a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer. A ground plane cap layer of electrically conductive material is provided below the last ground plane layer associated with a trace layer and beneath the coaxial connector center pins for preventing leakage of radio frequency energy between the center pins. A row of conductive vias can be provided along one or more sides of a trace carrying RF energy. These vias are connected to electrical ground references above and below the layer of the trace to electrically isolate the trace from radiating the RF energy. Portions of transition conductive vias and plated-through holes for the connector center pins are removed to adjust to the impedance of components and cables to which they are to be connected.

Backplane for radio frequency signals

The present invention is directed to a lifting and positioning system for use by a single person in installing onto or removing from an elevated position a microcell module, all without the aid of major powered machinery. In addition to the use of a portable hoist, a bracket for permanently mounting the microcell module to a desired surface at the installation site, and a lifting bracket that detachably mounts to the module, the lifting and positioning system of the present invention uses structural features of the microcell module itself to simplify installation and removal. In this latter manner, only a relatively small number of parts need to be carried to the installation site, and can be done so safely and without undue bodily strain.

Microcell module lifting and positioning system

An enclosure for electronic components which is provided with a heater mounted to an exterior wall to maintain a minimum operating temperature for the electronic components without utilizing space within the enclosure.

Heat providing structure for an electrical assembly

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Montclair, NJ, United States of America

Peter Giannoglou