Hewlett-packard Development Company, L.p.

Apple Inc.

Hewlett-packard Company

Hewlett Packard Enterprise Development LP

Hewlett-pakcard Company

Peter George Hartwell

Robert G Walmsley

Carl E Picciotto

Heon Lee

Chung-Ching Yang

Storrs Townsend Hoen

David Horsley

Wenhua Zhang

Tongbi T Jiang

Jonah Alexander Harley

Donald J Fasen

Duncan R Stewart

Jie-Hua Zhao

Lennie K Kiyama

David A Fattal

Raymond G Beausoleil

Zhiyong Li

Manoj K Bhattacharyya

Wei E Wu

Carl Philip Taussig

Janice H Nickel

Steven Rosenberg

Steven Louis Naberhuis

James A Brug

Donald J Milligan

Jian Guo

Chung Ching Yang

Paul P Merchant

Andrei Faraon

Rodney L Alley

Christopher E Balcells

Uija Yoon

An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. To reduce offset in the electronic compass, the magnetic flux concentrators may be demagnetized by applying a current to a coil in the housing. The coil may be formed from loops of metal traces within a printed circuit or other loops of conductive paths. Magnetic flux concentrators may have ring shapes. A ring-shaped magnetic flux concentrator may be formed from multiple thin stacked layers of soft magnetic material separated by non-magnetic material.

Electronic device having electronic compass with demagnetizing coil and annular flux concentrating yokes

MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.

Method of lower profile MEMS package with stress isolations

The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel. One example of forming such structures includes providing a first wafercomprising a bond layer of a particular thicknesson a surface of a substrate materialremoving the bond layerin a first area--to expose the surface of the substrate materialapplying a mask to at least a portion of a remaining bond layer----and a portion of the exposed surface of the substrate material in the first area---to form a second area exposed on the surface of the substrate materialetching the second area to form a cavityin the substrate materialand the bond layerand forming by the etching, in the cavitya structure--for restricting out-of-plane travel, where the structure--has a particular height from a bottom of the cavitydetermined by the particular thickness of the bond layer

Out-of plane travel restriction structures

Light-detection systems that do not destroy the light to be detected or change the propagation direction of the light are described. In one aspect, a light-detection system includes an optical element composed of a substrate with a planar surface and a polarization insensitive, high contrast, sub-wavelength grating composed of posts that extend from the planar surface. The posts and/or lattice arrangement of the posts are non-periodically varied to impart orbital angular momentum and at least one helical wavefront on the light transmitted through the optical element.

Light detection system including a chiral optical element and optical elements with sub-wavelength gratings having posts with varying cross-sectional dimensions

The present invention includes a method and system for processing images captured with an image-capturing device. According to the present invention, a method and system includes reconfiguring a display of an image based on the orientation of the image-capturing device when the image is captured. Through the use of the method and system in accordance with the present invention, a user can view captured images without having to account for a rotation of the image-capturing device. The method and system includes capturing the image with an image-capturing device, determining an orientation of the image-capturing device and reconfiguring a display of the image based on the orientation of the image-capturing device.

Method and system for processing an image

A sensor-location system for locating sensors in a tract covered by an earth-based sensor network. The sensor-location system includes at least one sensor-identification device, and at least one sensor locator. The sensor-identification device is affixed to a respective sensor in the earth-based sensor network. The sensor locator is configured for use from on board of an aircraft. In addition, the sensor locator is configured to acquire geographic-location data of said sensor including an identifying signature from the sensor-identification device of the sensor in the tract covered by the earth-based sensor network.

Sensor-location system for locating a sensor in a tract covered by an earth-based sensor network

Gyroscopes using surface electrodes are provided. In this regard, a representative microelectromechanical systems (MEMS) gyroscope, among others, includes a top substrate and a bottom substrate. The top substrate includes an outermost structure that is open and enclosed and a first driving structure that is disposed within the outermost structure and includes first driving electrodes disposed on a bottom surface. The bottom substrate is disposed below the top substrate and includes second driving electrodes disposed on a top surface of the bottom substrate. The second driving electrodes are substantially aligned below the first driving electrodes such that a force can be applied to the first driving structure by an electrostatic force generated between the first and second driving electrodes. The first and second driving electrodes are also configured to provide a capacitance signal based on the movement of the first driving structure.

Gyroscopes using surface electrodes

A resonator includes a translator, a stator, and a control circuit. The control circuit is configured to provide first and second translator voltages and first through third stator voltages, wherein the translator is configured to move with respect to the stator at a resonant frequency of the resonator in response to the control circuit.

Resonator having a stator coupled to three stator voltages

One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.

Chip cooling channels formed in wafer bonding gap

Encapsulated devices that can adjust the damping level within are provided. In this regard, a representative encapsulated device, among others, comprises a bottom substrate, a middle substrate that is disposed above the bottom substrate, and a top substrate that is disposed above the middle substrate. The middle substrate comprises an outermost structure and at least one damping device. The at least one damping device is supported to the outermost structure. At least one top gap and a bottom gap are formed between the at least one damping device and the top and bottom substrates, respectively. The at least one top gap has at least one cavity depth that is adapted to adjust the damping level of the encapsulated device.

Adjusting the damping level of an encapsulated device

An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first die and the fourth die.

Multi-die apparatus including moveable portions

One or more of a contact lithography module, a pattern tool and a substrate include a strain control region to prevent deformation-related misalignment.

Deformation-based contact lithography systems, apparatus and methods

A first device has a surface and includes a micrometer-scale or smaller geometry doped semiconductor region extending along the surface. A second device has a surface opposite the surface of the first device and includes a micrometer-scale or smaller wire extending through the second device to a position in proximity to the surface of the second device. The first and second devices are displaceable between first and second positions relative to each other. The wire is not substantially electrically coupled to the doped semiconductor region in the first position and the wire is substantially electrically coupled to the doped semiconductor region in the second position. A potential applied to the wire affects the conductivity of the doped semiconductor region in the second position.

System for coupling wire to semiconductor region

A first device has a micrometer-scale or smaller first structure and is flexibly coupled to a first substrate. A second device has a micrometer-scale or smaller second structure and is coupled to a second substrate. At least one actuator displaces at least one of the first and second devices relative to the other in response to a control signal. The control signal is generated by a controller to align the first and second structures and to control the at least one actuator to connect the displaced first and second devices.

Growing community of inventors

Sunnyvale, CA, United States of America

Peter George Hartwell