Siced Electronics Development Gmbh & Co Kg

Infineon Technologies Austria Ag

Siemens Aktiengesellschaft

Norstel Ab

Infineon Technologies Ag

Sciced Electronics Development Gmbh & Co. Kg

Peter Friedrichs

Heinz Mitlehner

Dethard Peters

Dietrich Stephani

Rudolf Elpelt

Reinhold Sch&ouml;rner

Reinhold Schörner

Alexandre Ellison

Björn Magnusson

Asko Vehanen

Ralf Siemieniec

Roland Rupp

Michael Treu

Larissa Wehrhahn-Kilian

Reinhold Schoerner

Hans-Joachim Schulze

Ralf Otremba

Edward Fuergut

Reinhard Maier

Gerd Griepentrog

Karl-Otto Dohnke

Karl Dohnke

A semiconductor chip includes a semiconductor body having a main surface and a rear surface opposite the main surface, a first bond pad disposed on the main surface, a second bond pad disposed on the rear surface, a first switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the first bond pad, and a second switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the second bond pad.

Multi-device semiconductor chip with electrical access to devices at either side

An electronic circuit includes a first transistor device with a control terminal and a load path. A drive circuit includes an input terminal and an output terminal. The output terminal is coupled to the control terminal of the first transistor device. The drive circuit is operable to drive the first transistor device dependent on an input signal received at the input terminal. A polarity detector is coupled in parallel with the load path of the first transistor device. The polarity detector includes a second transistor device and a current detector. The second transistor device includes a load path connected to the load path of the first transistor device. The current detector includes a sense path in series with the load path of the second transistor device and an output connected to the input terminal of the drive circuit.

Electronic circuit with a reverse conducting transistor device

A semiconductor device including a drift zone of a first conductivity type serving as a substrate layer having a front side and a back side. A first contact electrode is arranged at the front side of the drift zone. A control region is arranged at the front side and controls an injection of carriers of at least the first conductivity type into the drift zone. A second contact electrode is arranged at the backside of the drift zone. The drift zone is arranged to carry a carrier flow between the first and the second contact electrode. The drift zone includes a silicon carbide wafer with a net carrier concentration less than 10cmand a carrier lifetime of at least 50 ns.

Lightly doped silicon carbide wafer and use thereof in high power devices

A unipolar semiconductor component having a drift layer is produced by forming the drift layer with a continuously decreasing concentration of a charge carrier doping along the growth direction of the drift layer by way of epitaxial precipitation of the material of the drift layer, which comprises at least one wide band gap material. By using silicon carbide for the drift layer formed by the epitaxial precipitation, a subsequent change of the continuously decreasing concentration of the charge carrier doping due to a diffusion of the dopant atoms in downstream processes is suppressed. The production method can be used in particular to implement a unipolar semiconductor component comprising a drift layer, which component has an advantageous ratio of a comparatively high reverse bias voltage with relatively low forward losses, in a simple and/or cost-effective manner. The unipolar semiconductor component can be an active or passive semiconductor component.

Production method for a unipolar semiconductor component and semiconductor device

A manufacturing method provides a semiconductor device having a semiconductor body defining a source region, a body region, a drift region and a diode region. The drift region has a first drift region section and a second drift region section. The diode region is buried within the drift region, and has a semiconductor type opposite to the drift region to form a diode. The diode region is separated from the gate electrode by the first drift region section extending from the diode region in a vertical direction. The gate electrode is adjacent the body region and insulated from the body region by a gate dielectric. A source electrode is electrically connected to the source region, the body region and the diode region. A semiconductor region of a doping type opposite to the doping type of the drift region is arranged between the first drift region section and the source electrode.

Semiconductor device

A transistor component having a shielding structure. One embodiment provides a source terminal, a drain terminal and control terminal. A source zone of a first conductivity type is connected to the source terminal. A drain zone of the first conductivity type is connected to the drain terminal. A drift zone is arranged between the source zone and the drain zone. A junction control structure is provided for controlling a junction zone in the drift zone between the drain zone and the source zone, at least including one control zone. A shielding structure is arranged in the drift zone between the junction control structure and the drain zone and at least includes a shielding zone of a second conductivity type being complementarily to the first conductivity type. The shielding zone is connected to a terminal for a shielding potential. The at least one control zone and the at least one shielding zone have different geometries or different orientations in a plain that is perpendicular to a current flow direction of the component.

Transistor component having a shielding structure

A method for manufacturing a silicon carbide single crystal. A silicon carbide single crystal is grown. The crystal has a boron concentration less than 5&#xd7;10cm, and a concentration of transition metals impurities less than 5&#xd7;10cm. Intrinsic defects in the crystal are minimised. The intrinsic defects include silicon vacancies or carbon vacancies. The crystal is annealed for a desired time at a temperature above 700&#xb0; C. in an atmosphere containing any of the gases hydrogen or a mixture of hydrogen and an inert gas, such that the density of intrinsic defects and any associated defects is decreased to a concentration low enough to confer to the crystal a desired carrier life time of at least 50 ns at room temperature.

An embodiment of the invention relates to a switching system that includes a depletion-mode semiconductor device, such as a silicon carbide device, coupled in series with an enhancement-mode semiconductor device, such as a silicon field effect transistor, so that a controller can be configured to disable conductivity of the series arrangement of the two switches during a transient operating condition. During normal high-frequency switching operation, the controller persistently enables the enhancement-mode device to conduct while intermittently enabling the depletion-mode device to conduct. The controller disables the enhancement-mode device to conduct during a transient operating condition such as start up or during a fault, thereby providing circuit protection during such transients. The switching system preserves low loss switching characteristics of the depletion-mode device in a high-frequency switching circuit.

Simplified switching circuit

A method for making an integrated circuit including vertical junction field effect transistors is disclosed. One embodiment creates a vertical junction field effect transistor using a fault-tolerant or alignment-tolerant production process. The device performance is not harmed, even if misalignments in consecutive semiconductor processing steps occur.

Method for making an integrated circuit including vertical junction field effect transistors

An integrated vertical SiC&#x2014;PN power diode has a highly doped SiC semiconductor body of a first conductivity type, a low-doped drift zone of the first conductivity type, arranged above the semiconductor body on the emitter side, an emitter zone of a second conductivity type, applied to the drift zone, and at least one thin intermediate layer of the first conductivity type. The intermediate layer is arranged inside the drift zone, has a higher doping concentration than the drift zone, and divides the drift zone into at least one first anode-side drift zone layer and at least one second cathode-side drift zone layer. There is also disclosed a circuit configuration with such SiC&#x2014;PN power diodes.

SiC-PN power diode

A uniform silicon carbide single crystal with either an n-type or a p-type conductivity. The crystal has a net carrier concentration less than 10cmand a carrier lifetime of at least 50 ns at room temperature.

A switching device includes a working circuit, to which an operating voltage can be or is applied to which has at least one electronic switching element. This switching element includes at least one control terminal for applying a switching signal and is switched off or switched on depending on the switching signal. At least one electronic protection element is for protecting the switching element in its switched state from excessive Joule losses in the event of danger, especially in the event of an overload or a short circuit. The protection element bears the predominant part of the operating voltage that is released at the working circuit. The switching device includes a switching-off device, which, in the event of danger, automatically switches the switching element to the switched off state, using the energy contained in the operating current or the operating voltage passing through the working circuit or the voltage that is released at the working circuit or at the protection element exceeds a predetermined upper limit value.

Electronic switching device

A switching device includes at least one MOSFET switching element and at least one JFET protective element, which is connected electrically in series to the switching element and which limits the electric current to a maximum current (saturated current) and control elements, which increase the maximum current of the JFET protective element during the closing operation or in a time-delayed manner, at least in the temporal mean, to at least a higher value and subsequently reduce said maximum current to at least a lower value. The advantage of said switching device is that it allows higher starting or closing overcurrents, which are subsequently limited.

Electronic switching device and an operating method thereof

A semi-conductor structure for controlling and switching a current has a switch element and an edge element. The switch element contains a first semi-conductor area of a first conductivity type contacted by way of an anode electrode and a cathode electrode, a depletion area that is arranged inside the first semi-conductor area and that can be influenced by a control voltage applied to the control electrode for the purpose of current control, and an island area of a second conductivity type that is buried inside the first semi-conductor area. The edge element contains an edge area of the second conductivity type that is buried inside the first semi-conductive area and that is formed on a common level with the buried island area, in addition to an edge terminating area of a second conductivity type adjacent the edge area.

Semiconductor structure with a switch element and an edge element

The semiconductor device includes a first semiconductor region made from n-conducting SiC and a second semiconductor region made from p-conducting SiC. A Schottky contact layer electrically contacts the first semiconductor region, and an ohmic p-contact layer electrically contacts the second semiconductor region. Both contact layers consist of a nickel-aluminum material. This allows both contact layers to be annealed together without adversely effecting the Schottky contact behavior.

Growing community of inventors

Nürnberg, Germany

Peter Friedrichs