Other

Analog Devices,inc.

Volt Holdings Limited

Electrical Components International, Inc.

Peter Farrell

Michael W Judy

Lawrence E Felton

John R Martin

Xin Zhang

Maurice S Karpman

Timothy Spooner

Billy T Stojanovski

Jing Cheng Luo

Lewis Long

Nelson Kuan

William A Webster

David J Collins

Andrew Frame

Chetan Paydenkar

Nicole Hablutzel

Kevin H L Chau

A system and method for connecting a high voltage wiring harness assembly to a vehicle. The system includes a tubing configured to provide an enclosure for the high voltage wiring harness assembly. The material used to form the tubing includes polytetrafluoroethylene to protect the high voltage wiring harness assembly from abrasion and to insulate the high voltage wiring harness assembly from substantial temperature fluctuations. The system may include an adapter plate configured to provide a mechanical and electrical grounding connection to the vehicle. The system may include a coupling assembly configured to couple the tubing and the adapter plate. The coupling provides a water tight seal between the tubing and the adapter plate. The high voltage wiring harness assembly includes a grounding braid. The coupling assembly is further configured to couple the grounding braid to the adapter plate for completing an electrical circuit between the grounding braid and the vehicle.

System and method for improved mechanical and electrical connection of high voltage wiring harness

A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Power cable with an overmolded probe for power transfer to a non-thermal plasma generator and a method for constructing the overmolded probe

A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Stress mitigation in packaged microchips

A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

Packaged microchip with premolded-type package

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

MEMS capping method and apparatus

Growing community of inventors

Rochester, NY, United States of America

Peter Farrell