Kollmorgen Technologies Corporation

Peter E Takach

Rudolph J Zeblisky

Denis M Morrissey

Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component which causes the plating to preferentially occur at said sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out.

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Garden City South, NY, United States of America

Peter E Takach