Cascade Microtech, Inc.

Formfactor Beaverton, Inc.

Peter Douglas Andrews

David Randle Hess

John L Dunklee

Brad Froemke

Kenneth R Smith

Paul A Tervo

Randy J Schwindt

Warren K Harwood

Richard H Warner

Robert New

David Michael Newton

Probe systems and methods for automatically maintaining alignment between a probe and a device under test (DUT) during a temperature change. The methods include collecting an initial image of a planar offset fiducial and determining an initial height reference of a height offset fiducial. The methods further include changing a temperature of the DUT, automatically maintaining a planar alignment between a probe and the DUT during the changing, and automatically maintaining a height alignment between the probe and the BUT during the changing. The probe systems include a chuck, which defines a support surface configured to support a substrate that includes the DUT, and a probe head assembly, which includes a probe configured to contact a corresponding contact pad of the DUT. The probe systems further include a substrate thermal module, which is configured to regulate a temperature of the DUT, and a controller programmed to execute the methods.

Probe systems and methods for automatically maintaining alignment between a probe and a device under test during a temperature change

Focusing optical systems and methods for testing semiconductors are disclosed herein. The methods include receiving an image of a probe through a single optical path of a microscope, substantially focusing the microscope on the probe, and determining a vertical height adjustment between the probe and a device under test based upon the focusing.

Focusing optical systems and methods for testing semiconductors

A testing system that includes an plural imaging devices capturing plural video sequences from a single optical path and concurrently displaying the video sequences for effectively positioning a probe for testing a semiconductor wafer.

System for testing semiconductors

A system includes an imaging device for capturing a video sequence and a display for displaying the video in a window of the display and effectively positioning a probe relative to probe pads of a device under test for testing a semiconductor wafer supported by a support of a probing environment.

Interface for testing semiconductors

An improved chuck with lift pins within a probe station. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

Chuck with integrated wafer support

A semiconductor testing system that includes an plural imaging devices for capturing plural video sequences from a single optical path and concurrently displaying the video sequences for effectively positioning a probe for testing a semiconductor wafer.

A system includes an imaging device suitable for effectively positioning a probe for testing a semiconductor wafer. The system includes an objective lens for sensing the device under test and an imaging device sensing a first video sequence including multiple frames of an overlapping region of the device under test. A video signal is provided to a display including multiple frames of the overlapping region of the device under test. An operator indicating a region of the video signal of devices under test and the system in response presenting an enlarged view of a plurality of different regions of the device under test in a plurality of windows free from user input, where the region and the plurality of different regions are simultaneously displayed on the display.

An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

An improved chuck with lift pins within a probe station.

A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly which consists of at least three chuck assembly elements. A first element supports the test device, while an underlying second element acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element. Ready-to-use, selectively detachable electrical connector assemblies provide for signal and guard connections to the first and second chuck assembly elements, respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors for individually-positionable probes provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.

Growing community of inventors

Beaverton, OR, United States of America

Peter Douglas Andrews