Motorola Corporation

Osram Sylvania Inc.

Peter Doikas

Jeffrey D Merwin

David G Geis

David Geis

Jeffrey Demonaco

A method (,) for providing an electrical ground connection between a printed circuit board (,) and a metallic substrate (,) comprises the steps of: (i) providing an aperture (,) in the substrate (,); (ii) forming a ground plug (,) out of a metallic blank (,); (iii) inserting the ground plug (,) into the aperture in the substrate (,); (iv) compressing the ground plug (,) into the aperture (,) in the substrate (,); (v) placing the printed circuit board (,) onto the substrate (,); and (vi) applying solder into the aperture in the printed circuit board (,) and onto the ground plug (,). The steps of forming (,), inserting (,), and compressing (,) are carried out in a single punching operation (,). The method (,) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

Method for providing an electrical ground connection between a printed circuit board and a metallic substrate

A ballast housing (10) comprising a base (100), a cover (200), an input connector (300), and an output connector (400). Input connector (300) and output connector (400) serve as end-caps of the housing (10), and provide solderless connections between external wires and the ballast circuitry. The base (100) has formed edges (132,142) that are received into corresponding channels (242,252) in the cover (200). Tabs on the connectors (300,400) and corresponding apertures in the base (100) and cover (200) provide a secure ballast housing that accommodates efficient provision of input and output wires.

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Arlington Heights, IL, United States of America

Peter Doikas