Nxp B.v.

Npx B.v.

Peter Dirks

Klaas Heres

Dirk Groeneveld

A method of manufacturing an inductor embedded into a semiconductor chip package () is described, which method comprises providing a carrier () having, between a first side and an opposite second side, a first conductive layer (), an intermediate layer (), a second conductive layer (), forming an inductor and contact pads for the chip by patterning the first conductive layer () from the first side of the carrier (), assembling the chip and providing an encapsulation () and forming terminals of the package, by patterning the second conductive layer () from the second side of the carrier.

Embedded inductor and method of producing thereof

A dual or multiple row package () is provided which comprises a first plurality of terminals () and a second plurality of terminals (), which first and second plurality of terminals are exposed outside the encapsulation at a first side of the package. The terminals of the first plurality of terminals () are arranged in a first row (), wherein a distance between each pair of adjacent terminals in the first row () is greater or equal than a first threshold value. Furthermore, the terminals of the second plurality of terminals () are arranged in a second row (), wherein a distance between each pair of adjacent terminals in the second row () is greater or equal than a second threshold and a distance between the first row () and the second row () is smaller than at least the first threshold value.

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Valkenswaard, Netherlands

Peter Dirks