Semiconductor Components Industries, LLC

Peter Dingenen

Thomas Neyer

Wai Lun Chu

YunPeng Xiao

Thierry Bordignon

Vaclav Valenta

Stanley Benczkowski

Mehrdad Baghaie Yazdi

Christopher Lawrence Rexer

Hyeongwoo Jang

Roman Sickaruk

Tirthajyoti Sarkar

James Joseph Victory

Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.

Systems and methods for designing a discrete device product

Growing community of inventors

Oudenaarde, Belgium

Peter Dingenen