Robert Boschgmbh

Peter Diesel

Dmitriy Aranovich

Michael Schlitzkus

Stefan Lehenberger

Robert Hengler

Christian Pfleger

Philip Martin Lenk

Nikolai Bauer

Andreas Moehrle

Gerald Brinks

Ulrich Seger

Joerg Engelhardt

Moritz Winkler

Guenter Escher

Guido Bernd Finnah

Hartmut Rohde

Matthias Pohl

Daniel Beurer

A camera module that includes an objective lens with an electrical interface and a device for electrically contacting the objective lens in the area of the electrical interface. The device for electrically contacting are also connected to an electronics system, in particular to a circuit board, of the camera module. The electrical interface is formed at the objective lens on the outer circumferential side, and the device for electrical contacting includes an annular body situated on the objective lens on the outer circumferential side, with contacts formed on the inner circumferential side. A method for manufacturing a camera module is also provided.

Camera module, method for manufacturing a camera module

A method for manufacturing a camera module. The method includes: a) mounting an image sensor on a circuit board, b) inserting and fixing the circuit board into a housing, c) aligning an objective lens accommodated in the housing and including an electrical interface with respect to the image sensor, d) fixing the objective lens in the housing. In step b) spring contacts, which are movable with respect to the circuit board, are inserted into the housing together with the circuit board and, in a step e), i.e., after the fixation of the objective lens in the housing, are brought into contact with the electrical interface with the aid of clamping and/or fixing elements.

Method for manufacturing a camera module, camera module

A camera module. The camera module includes a circuit board on which at least one image sensor is situated; an objective including a lens housing and multiple optical lenses situated inside the lens housing; an objective holder, which is connected to the circuit board and is designed to hold the objective; and at least one temperature control element, which is designed to influence the temperature of at least one front lens of the objective; a second optical lens being situated at the front lens. The front lens and/or the second optical lens includes/include at least one recess, the at least one temperature control element being situated in the at least one recess.

Camera module and method for manufacturing a camera module

A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.

Connection device for a pressure sensor, pressure sensor, and method for producing a connection device

A housing for mounting a component that includes an image sensor, a fixed installation space being provided in the interior of the housing for accommodating at least one optical component. The housing has at least one outer receiving recess that is spatially separate from the interior of the housing. This outer receiving recess is provided for receiving at least one positioning element in a way that allows the positioning element to define a support plane relative to the housing, and the component including the image sensor to be placed on the positioning element, so that the component including the image sensor resides in the defined support plane. In this case, the component including the image sensor may be placed in the defined support plane in a way that does not allow any direct contact between the component that includes the image sensor, and the housing.

Camera housing for adjusting an optical system

A support unit for a circuit board in a sensor unit comprises a main body that defines an outer contour and includes a first joining geometry and a second joining geometry. The first joining geometry is configured to at least one of guide and electrically contact external contact elements, and includes contact receiving pockets configured to guide the external contact elements, and at least one reinforcement web that separates two adjacent contact receiving pockets. The second joining geometry is configured to join the support unit to the circuit board. The first joining geometry defines at least in part an external interface via which at least one electrical output signal of the circuit board is tapped.

Support unit for a circuit board in a sensor unit and corresponding sensor unit

A circuit carrier for a sensor unit comprises a first interface via which at least one electrical output signal is tapped at least at one connection point of a measuring cell, a second interface via which the at least one electrical output signal of the measuring cell is applied via at least one first contact element to a circuit board with an electronic circuit, and a hollow, cylindrical main body. The main body includes an inner joining geometry defined on an inner contour which defines at least in part the first interface, an outer joining geometry which defines at least in part the second interface, and configured to electrically connect to a connection point of the measuring cell in a force-free manner. The outer joining geometry is configured as a receiving pocket with a protruding collar, and includes the at least one first contact element.

Circuit carrier for a sensor unit and corresponding sensor unit

An arrangement for the direct contacting of contact mechanism has a first contact mechanism arranged on a contact carrier and a second contact mechanism. The second contact mechanism acts with a predetermined contact force on the first contact mechanism. The contact carrier includes a plastic injection premolding of galvanizable plastic and a nongalvanizable plastic. The galvanizable plastic has a predetermined resilient behavior and the first contact mechanism is formed by a metal layer having predetermined dimensions. The first contact mechanism can be applied onto the galvanizable plastic in a galvanic process. The resilient behavior of the galvanizable plastic and the dimensions of the metal layer form, under the predetermined contact force, a microdepression configured to guide the second contact mechanism in the first contact mechanism. A corresponding connection device for a pressure measurement cell includes such a direct contacting arrangement.

Arrangement for the direct contacting of contact mechanism and associated connection unit for a pressure measurement cell

A sensor unit has at least one measuring cell and a circuit mount arranged in a protective sleeve. The measuring cell detects a pressure of a hydraulic block. The circuit mount has a printed circuit board, which is positioned perpendicularly relative to the measuring cell. The printed circuit board has an electronic circuit with at least one electronic and/or electrical component. The measuring cell has at least one connection point configured to tap off at least one electrical output signal from the measuring cell. The circuit mount forms an internal interface which taps off the at least one electrical output signal from the measuring cell and applies it to the electronic circuit. An output signal from the electronic circuit can be tapped off by an external interface. The internal interface is formed at a first end and the external interface is formed at a second end of the protective sleeve.

Growing community of inventors

Bad Hindelang, Germany

Peter Diesel