Applied Materials, Inc.

Peter Demonte

Rongping Wang

Yoshinobu Mori

Jon Christian Farr

Shinichi Oki

Yuji Aoki

Mahadev Joshi

Chethan Mangalore

Ruizhe Ren

Trishul Byregowda Shivalingaiah

Parthiban Balakrishna

Karthik Melinamane Prabhakar

Skanda Simha Chandrashekar

Embodiments of interferometric endpoint (IEP) housing assemblies for endpoint detection of plasma processing are provided herein. In some embodiments, IEP housing assemblies include: an IEP housing having an upper end configured to interface with a light source and having an internal cavity, wherein a lower end of the IEP housing is configured to interface with a dome assembly of a process chamber; a bracket having a body disposed about the IEP housing and having a plurality of arms extending radially outward from the body; and a plurality of biasing members extending from the body to the IEP housing and configured to hold the IEP housing within the body while allowing side-to-side deflection.

Self-aligning interferometric end point housing

A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.

Support assembly for substrate backside discoloration control

Embodiments of the present disclosure include a radial frequency plasma source having a split type inner coil assembly. In one embodiment, the split type inner coil assembly comprises two intertwining coils. In another embodiment, the split type inner coil assembly includes looped coils forming a dome.

Source RF power split inner coil to improve BCD and etch depth performance

Growing community of inventors

Millbrae, CA, United States of America

Peter Demonte