Applied Materials, Inc.

Peter Demonte

Rongping Wang

Yoshinobu Mori

Jon Christian Farr

Shinichi Oki

Yuji Aoki

Chethan Mangalore

Ruizhe Ren

Parthiban Balakrishna

A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.

Support assembly for substrate backside discoloration control

Embodiments of the present disclosure include a radial frequency plasma source having a split type inner coil assembly. In one embodiment, the split type inner coil assembly comprises two intertwining coils. In another embodiment, the split type inner coil assembly includes looped coils forming a dome.

Source RF power split inner coil to improve BCD and etch depth performance

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Millbrae, CA, United States of America

Peter Demonte