Hrl Laboratories, LLC

Gm Global Technolgoy Operations, Inc.

The Boeing Company

Hughes Aircraft Company

Hughes Electronics Corporation

Peter David Brewer

Alan Jon Jacobsen

William B Carter

Jeffrey Allan Rock

Gerald W Fly

Yeh-Hung Lai

Keith E Newman

Andrew T Hunter

Sevag Terterian

Charbel Abijaoude

Ping Liu

Chia-Ming Chang

Aurelio Lopez

Diego Eduardo Carrasco

Jonathan James Lynch

Tahir Hussain

Carl W Pobanz

Yakov Royter

Larken Elizabeth Euliss

Brett Z Nosho

Keith V Guinn

Nicole L Abueg

G Michael Granger

John J Vajo

David M Pepper

Mehran Matloubian

Keyvan R Sayyah

David H Chow

Pamela R Patterson

Keith John Davis

Jennifer J Zinck

Erik S Daniel

John A Roth

Anson Y Au

Clifford A Lebeau

Partia Naghibi-Mahmoudabadi

Adam Franklin Gross

James H Schaffner

Hyok Jae Song

Hung P Nguyen

Rajesh D Rajavel

Jeffrey L Rogers

Joseph S Colburn

Kyung-Ah Son

Robert E Doty

Michael G Case

Joanna A Kolodziejska

Kenneth Robert Elliott

Jeff D Williams

Harris P Moyer

Yan Tang

Terence J DeLyon

Dana C Wheeler

Gregory L Olson

Luisa M Deckard

Owen K Wu

Andy Hunter

Angela Shum

Maryam Behroozi

Partia Naghibi Mahmoudabadi

Brett Nosho

Larken E Euliss

A reversable attachment system includes an adhesion layer, an inter-substrate bond structure, a mating layer and an extension actuator. The adhesion layer is configured to attach to a first substrate. The inter-substrate bond structure is coupled to the adhesion layer. The mating layer is configured to attach to a second substrate. The extension actuator is configured to attach to the second substrate and expand in response to an absorption of a gas. The inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat. The expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.

Reversable attachment system

A method and apparatus for laterally urging two semiconductor chips, dies or wafers into an improved state of registration with each other, the method and apparatus employing microstructures comprising: a first microstructure disposed on a first major surface of a first one of said two semiconductor chips, dies or wafers, wherein the first microstructure includes a sidewall which is tapered thereby disposing it at an acute angle compared to a perpendicular of said first major surface, and a second microstructure disposed on a first surface of a second one of said two semiconductor chips, dies or wafers, wherein the shape of the second microstructure is complementary to, and mates with or contacts, in use, the first microstructure, the second microstructure including a surface which contacts said sidewall when the first and second microstructures are mated or being mated, the sidewall of the first microstructure and the surface of the second microstructure imparting a lateral force for urging the two semiconductor chips, dies or wafers into said improved state of registration.

Integrated mechanical aids for high accuracy alignable-electrical contacts

A method to aid in a calibration of a compression system includes mounting a first substrate in a press. The press has calibration parameters, and the first substrate has a test film on a first surface. The method includes mounting a second substrate in the press. The second substrate has spikes arranged in a spike pattern on a second surface. The method includes compressing the first substrate and the second substrate together with a force that causes the spikes to form indentations in the test film, separating the first substrate from the second substrate, determining local pressures applied by the spikes against the test film, and adjusting one or more calibration parameters of the press in response to the local pressures.

Compression system calibration

A device and method for measuring the force generated by an expanding micro-actuator structure whose displacement is typically in the sub-micron range. Measurement of forces that occur at small displacements falls beyond the range of traditional load cell technology whose transducers require a minimum travel to record force changes. The force measurement of this invention uses spike arrays (nanometer tipped microstructure constructed of hard materials) together with a softer blank film that is imprinted by the array of spikes. The force may be determined by inverting the nano-indentation problem where the hardness (H) of the material is related to the applied force (F) of the nano-indenter by measuring the imprinted divot area (A) using the equation H=F/A. Alternatively, the force may be determined by comparing the imprinted pattern with known, standardized samples.

Spike arrays for small displacement force measurement

A method to align targets on opposite sides of a substrate includes forming a first via pattern in a protective layer on a first side of the substrate. The substrate includes a second side opposite the first side. The first via pattern is a first pixelated version of a first alignment target. The first alignment target is optically recognizable by an automated alignment system. The method includes etching a plurality of first vias through the substrate to the second side in the first via pattern. The first via pattern is optically recognizable by the automated alignment system as the first alignment target on both the first side and the second side of the substrate.

Alignment of targets on opposite sides of a substrate

An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.

Reworkable inter-substrate bond structure

A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.

Tilt calibration for probe systems

A method for bonding two confronting electronic devices together wherein the two electronic devices are initially temporarily coupled together using a room temperature process with a plurality of knife-edge microstructures on at least a first one of the electronic devices engaging portions of the a second one of the electronic devices. The room temperature process involves applying a relatively low compressive force or pressure between the two electronic devices compared to the forces or pressures used in convention flip-chip bonding. The first one of the electronic devices and the second one of the electronic devices also have traditional contact pads that are spaced from each other by a standoff distance when the devices are initially coupled together using the room temperature process. This allows for inspection of the two electronic devices while they are initially temporarily coupled together. In need be, the two can be separated at this stage for re-work After passing inspection, a relatively higher compressive force or pressure is applied between the two electronic devices to cause the standoff distance to decrease to zero and for the contact pads confronting each other on the confronting two electronic devices to weld thereby permanently bonding the two electronic devices together.

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.

Substrate debonding from bonded part

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Small pitch integrated knife edge temporary bonding microstructures

A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

System and method for bonding a cable to a substrate using a die bonder

The present disclosure relates to solution processed nanomaterials, and methods for their manufacture, with activity in the infrared (IR) region for a variety of commercial and defense applications, including conformal large-area IR coatings, devices and pigments that necessitate an absorption band edge in the MWIR or LWIR.

IR absorbing coatings comprising fluorinated nanoparticles

The disclosed antenna structures and electronic microsystems are capable of physically disappearing in a controlled, triggerable manner. Some variations provide an on-chip transient antenna comprising a semiconductor substrate containing ion-implanted hydrogen atoms and a conductor network comprising metals bridged by low-melting-temperature metals. Some variations provide an off-chip transient antenna comprising a flexible substrate containing a polymer, nanoporous silicon particles, and an oxidant for silicon, and a conductor network comprising metals bridged by low-melting-temperature metals. Other variations provide a method of introducing physical transience to a semiconductor integrated circuit, comprising thinning a substrate from the back side, implanting hydrogen ions into the thinned substrate to introduce latent structural flaws, depositing a semiconductor integrated circuit or sensor chip, and providing a controllable heating source capable of activating the latent structural flaws. These novel approaches are compatible with existing integrated circuits processing, preserve antenna performance, and use foundry-compatible techniques.

Transient antennas and transient electronics

A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.

Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices

Growing community of inventors

Westlake Village, CA, United States of America

Peter David Brewer