Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Evonik Rohm Gmbh

Henkel US IP Lcc

Henkel IP & Holding Gmbh and Henkel Ag & Co. Kgaa

Peter D Palasz

Charles Willard Paul

Yuxia Liu

Paul B Foreman

Mark M Konarski

John Gregory Woods

Stefan Hilf

Maria Xenidou

Andrew Slark

Simon Krause

Guillaume Chauveau

Kerstin Van Wijk

Ming Chang Lu

The present invention relates to a UV curable adhesive composition comprising a UV curable acrylic polymer comprising at least one covalently bound UV-reactive group and a cationic photoinitiator and a method of curing such composition. The invention further includes hot melt pressure sensitive adhesives comprising such cured composition and use of said hot melt pressure sensitive adhesives.

UV curable adhesives based on acrylic polymers

Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Optically clear hot melt adhesives and uses thereof

The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Curable encapsulants and use thereof

A block-copolymer containing at least two different blocks wherein block A contains (meth)acrylate monomers the copolymer having a glass transition temperature of less than 15&#xb0; C., block B contains (meth)acrylate monomers the copolymer having a glass transition temperature of more than 25&#xb0; C. being free of thio-containing substances in the polymer chain, characterized in that one block contains at least one photoinitiator chemically bound to the chain.

Block-copolymer containing crosslinkable photoinitator groups

Disclosed is a method for formation of block copolymers using a Single Electron Transfer Living Radical Polymerization (SET-LRP) process. The process can be used to form di and tri-block copolymers from vinyl monomers. In one embodiment the SET-LRP process comprises initially forming a macroinitiator using SET-LRP to form a first block of a di or tri-block copolymer and then using SET-LRP to form additional blocks of the copolymer. The produced block copolymers have very narrow polydispersity indexes and controlled molecular weights. The process permits incorporation of photoinitiators in any of the block formation reactions. The method also includes purification processes that result in a block copolymer having very low color making it useful in a variety of applications. In one application block copolymers prepared according to the present process can be used in hot-melt adhesives.

Photocrosslinkable block copolymers for hot-melt adhesives

An ultraviolet (UV) crosslinkable acrylic pressure sensitive adhesive comprises an acrylic copolymer and a cationic photoinitiator. The acrylic copolymer comprises pendant reactive functional groups. The pressure sensitive adhesive formed from the acrylic copolymer with the pendant reactive functional groups result in high green strength and/or high temperature holding strength of the adhesive.

Cationic UV-crosslinkable acrylic polymers for pressure sensitive adhesives

Radiation curable adhesive compositions comprising an acrylic polymer and a polyolefin find use in the manufacture of pressure sensitive adhesive articles such as, for example, tapes.

Acrylic hot melt adhesives

High durable polarized film comprising a radiation curable PSA layer for lamination in TFT/LCD applications have high humidity and heat resistance. In one embodiment, the adhesive comprises a UV curable acrylic polymer, a compatible tackifier, a multifunction unsaturated oligomer, and a long chain alkyl acrylate monomer.

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Maidenhead, United Kingdom

Peter D Palasz