Tyco Electronics Corporation

Peter Clark O'Donnell

Lynn Robert Sipe

Richard Nicholas Whyne

John Edward Knaub

Darrell Lynn Wertz

Andrew Dewitt Balthaser

Chad William Morgan

James Lee Fedder

Attalee Snarr Taylor

David Allison Trout

Alex Michael Sharf

Timothy Robert Minnick

Jeffrey Byron McClinton

David Wayne Helster

Keith McQuilkin Murr

Douglas Wade Glover

Evan Charles Wickes

David B Sinisi

David Keay Fowler

Robert Frederick

Alan Anthony Kordas

Hollis P Raymond

George Richard Defibaugh

Chad Williams Morgan

Donald Everett Wood

An electrical connector system may include multiple wafer assemblies configured to engage with a substrate. A ground strip of the electrical connector system may be coupled with a first wafer assembly and a second wafer assembly. The ground strip is configured to engage with the substrate and provide a common ground potential between the first wafer assembly, the second wafer assembly, and the substrate.

Electrical connector system

High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

A socket is shown having an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. The substrates are located relative to a mating device by way of pins attached to the substrate. The pins are locked to the substrate by way of a locking device, whereby the pins are rotated and locked in place.

Socket having substrate locking feature

A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.

Metal contact LGA socket

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Dillsburg, PA, United States of America

Peter Clark O'Donnell