Cutek Research, Inc.

Peter Cho

Chiu H Ting

Frank Lin

William H Holtkamp

Wen C Ko

Kenneth J Lowery

Tanya Andryushchenko

A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.

Process chamber and method for depositing and/or removing material on a

A copper replenishment system for replenishing copper which is depleted from a copper plating solution. The replenishment is achieved by the use of a compact filter cartridge, which is inserted into a recirculating loop for the solution. The filter cartridge contains a chemical, which when reacting with the solution replenishes the copper into the solution. The filter cartridge is a compact unit which can be easily handled and reduces the amount of contaminants that could be introduced by the presence of the replenishment chemical.

Copper replenishment technique for precision copper plating system

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Los Angeles, CA, United States of America

Peter Cho