Intel Corporation

Other

Neutron Holdings, Inc.

Sony Corporation

Sony Group Corporation

Peter Chang

Kunjal ShyamKumar Parikh

Jia-Hung Tseng

Willy Rachmady

Rafael Rios

Stephen M Cea

Khaled Ahmed

Kelin J Kuhn

Seiyon Kim

Annalisa Cappellani

Titash Rakshit

Martin D Giles

Shawna M Liff

Mauro J Kobrinsky

Henning Braunisch

Bruce A Block

Ibrahim Ban

Prakash K Radhakrishnan

Michael C Mayberry

Johanna M Swan

Albert I Lee

Tom E Pearson

Miriam Ruth Reshotko

Chytra Pawashe

Gerrit John Vreman

Yang Song

Hung Yui Lo

Henry Weston Bradlow

Meng Xie

Punit Nitin Shah

Houchang Lu

Xiaoxiao Hou

Siwei Wang

Dong Yeung Kwak

Edris M Mohammed

Ravi Ranganathan

Kumaran Natarajan

Brian Corbett

Roberto Pagano

Methods of forming microelectronic structures are described. Embodiments of those methods include forming a nanowire device comprising a substrate comprising source/drain structures adjacent to spacers, and nanowire channel structures disposed between the spacers, wherein the nanowire channel structures are vertically stacked above each other.

Silicon and silicon germanium nanowire structures

Presented here is a system and method for creating easy-to-understand notifications of the vehicle state. The notification can be visual or can be auditory and can indicate to the user the vehicle state even when the user's attention is directed elsewhere. The indication can serve to attract the user's attention before more involved information is presented to the user, such as text, or the indication can serve to communicate to the user the vehicle state in an easy-to-understand way such as using color-coded displays or audio indications. The intensity of the indication can be adjusted based on the likelihood that indication will be perceived by the user by, for example, measuring ambient light and/or ambient noise. Reducing the intensity of the indication conserves energy of an energy source associated with the vehicle.

Creating easy-to-understand indications of a vehicle state

A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.

Micro-LED displays

A mobile computing device comprising a Light Emitting Diode (LED) display; including a display panel and a substrate, and two or more controller integrated circuits mounted (ICs) mounted on the substrate to directly drive a serial interface into the display panel.

Micro LED display miniaturization mechanism

Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

Display including an LED element having a pressure sensitive adhesive (PSA) for micro pick and bond assembly of the display

Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

Micro pick and bond assembly

Embodiments of the invention include systems and methods for transferring micro LEDs. In an embodiment, the system for transferring micro LEDs, may include a donor substrate bank that is capable of supporting a plurality of donor substrates on which a plurality of micro LEDs are formed. In an embodiment, the donor substrate bank is moveable in the X, Y, and Z directions. In an embodiment, the system may also include a host substrate table that is capable of supporting a host substrate. The host substrate may include a plurality of segments. In an embodiment, the host substrate table is moveable in the X, Y, and Z directions. Embodiments of the invention may also include an array of macro transfer heads. In an embodiment, each macro transfer head may include a plurality of micro transfer heads.

Apparatus for micro pick and bond

Crystalline (micro)LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro)LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.

MicroLED display and assembly

Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.

Optical I/O system using planar light-wave integrated circuit

Growing community of inventors

Portland, OR, United States of America

Peter Chang