Phase Metrics, Inc.

Seagate Technology Incorporated

Caliper Technologies Corporation

Tencor Instruments

Caliper Life Sciences, Inc.

Hmt Technology Corporation

Peter C Jann

Anne R Kopf-Sill

Andrea W Chow

Colin B Kennedy

Michael A Spaid

Morten Juel Jensen

Michael J Kennedy

Armand P Neukermans

George A Burt, Jr

Wafaa Abdalla

Stanley E Stokowski

Kenneth P Gross

Ralph C Wolf

Ming M Yang

Joel M Libove

Kenneth H Womack

Wayne W Li

David Wolze

Marco A Krumbuegel

Igor Iosilevsky

Vlastimil Cejna

Reginald Lee

An apparatus for detecting defects on a disk surface includes a light source that generates a light beam and a beamsplitter that splits the light beam into a first light beam portion and a second light beam portion. The first light beam portion illuminates the surface of the disk and produces a reflected light beam. An acoustic-optic deflector deflects the reflected light beam and the second light beam portion producing a deflected output beam having a deflection angle. A detector detects an incident beam translation signal corresponding to reflected light beam angular deflection and acoustic-optic deflector beam angular deflection from the deflected output beam.

Surface inspection by amplitude modulated specular light detection

A double pass apparatus for detecting defects on a disk surface includes a light source that generates a light beam and a beamsplitter that splits the light beam into a first light beam portion and a second light beam portion. A modulator is provided that modulates the second light beam portion into a frequency shifted modulated light beam for illuminating the surface of the disk. The frequency shifted modulated light beam is twice reflected from the surface of the disk, thus doubling the frequency shift of the reflected light beam. A polarizing beamsplitter combines the first light beam portion with the reflected light beam portion providing an interference signal.

Surface inspection by double pass laser doppler vibrometry

Analytical systems and methods that use a modular interface structure for providing an interface between a sample substrate and an analytical unit, where the analytical unit typically has a particular interface arrangement for implementing various analytical and control functions. Using a number of variants for each module of the modular interface structure advantageously provides cost effective and efficient ways to perform numerous tests using a particular substrate or class of substrates with a particular analytical and control systems interface arrangement. Improved optical illumination and detection system for simultaneously analyzing reactions or conditions in multiple parallel microchannels are also provided. Increased throughput and improved emissions detection is provided by the present invention by simultaneously illuminating multiple parallel microchannels at a non-normal incidence using an excitation beam including multiple excitation frequencies, and simultaneously detecting emissions from the substances in the microchannels in a direction normal to the substrate using a detection module with multiple detectors.

Ultra high throughput microfluidic analytical systems and methods

An apparatus for measuring the height and diameter of laser-zone texture bumps on a rigid magnetic disk substrate is disclosed. The apparatus has a disk holder for supporting and rotating the substrate, and an optical beam-source assembly for directing a focused laser beam on the substrate, and for shifting the position of the beam's illumination spot on the substrate in a tracking (radial) direction. An optical detection assembly in the apparatus measures the deflection of the laser beam due to specular reflection of the beam by laser-zone texture bumps, as a function of time, in both scanning (circumferential) and tracking directions. A computational device in the apparatus functions to (i) calculate scanning and tracking deflection values which characterize beam deflections in the scanning and tracking directions, respectively, for a texture bump passing through the illumination spot produced by the beam on the substrate, (ii) select for bump-height analysis, those texture bumps whose scanning deflection values are above a selected threshold value and whose tracking deflection values are below a selected threshold value, indicative of a condition in which the selected textured bumps are each in focus and centered within said illumination spot, and (iii) determine the texture bump heights and diameters of the selected bumps from the beam deflections in the scanning direction. Also disclosed is a method by which the apparatus measures the light power which is scattered by the of laser-zone texture bumps on a rigid magnetic disk substrate.

Laser-bump sensor method and apparatus

A simple yet versatile non-contact optical inspection instrument and method are described for measuring the height and width of defects and contaminants on a magnetic disk surface. The instrument includes a sensor which produces an illumination beam that is modulated and then focused normally on the disk surface as a spot. The illumination spot is Doppler shifted due to the movement of the disk and the diffusely reflected light is interfered with a reference beam produced by the sensor's illumination optics. The sensor uses two collection optics channels which simultaneously detect both the specular reflected light and the diffuse scattered light produced by the disk surface. The phase shift of the specular reflected light and that of the diffusely scattered light are measured. The output signals from the sensors are processed to estimate the size and type of the defects. Another aspect of the present invention includes a demodulator which increases the frequency of an FM signal. Pulses representing the zero-crossings of the signal are generated and filtered to provide a voltage that is proportional to the frequency of the FM signal. Because the pulse train has a frequency that is significantly greater than the input frequency, a low-pass filter with both a high cut-off frequency and a gradual roll-off in frequency response may thus be used to optimize the output or demodulated signal in terms of increased bandwidth or faster response and more linear group delay.

Method and apparatus for detecting defects on a disk using

A simple yet versatile noncontact optical inspection instrument and method are described for the inspection of magnetic disk surfaces for surface defects. This instrument is capable of inspecting the disk surface at any point in the disk manufacturing process. Surface defects such as bumps, pits and scratches can be measured. Surface contaminants such as particles and stains can also be measured. The instrument is also capable of discriminating between surface defects and surface contaminants. The instrument is comprised of two identical optical sensors which are located on opposite sides of the disk. A carriage supports and translates these sensors along the disk radius while a spindle rotates the disk. Both surfaces of the disk are therefore simultaneously scanned in a spiral fashion. The sensor's illumination optics produce a monochromatic focused spot of light which is normally incident upon the disk surface. The sensor uses two collection optics channels which simultaneously detect both the specular reflected light and the diffuse scattered light produced by the disk surface. Both the angle and power of the specular reflected light are measured, while just the power of the diffuse scattered light is measured. The output signals from the sensors are processed to estimate the size of the defects and to determine the type of defect.

Apparatus and method for surface inspection by specular interferometric

An optical sensor which provides a focused elliptical illumination spot. The instrument includes a light source which provides a light beam that is directed through a cylindrical lens. The cylindrical lens focuses the light beam normally on a disk surface as an elliptical illumination spot with a major axis along a tracking direction and a minor axis along a scanning direction. Light scattered by the disk is then detected by a detector and processed to detect defects on the disk surface.

Optical sensor with an elliptical illumination spot

A surface inspection apparatus having multiple inspection stations to inspect a wafer for a number of characteristics. The wafer is placed on a chuck connected to a rack-and-pinion or equivalent system so that the wafer simultaneously rotates and translates under the fixed position of the inspection stations. A single light source may be used by all stations in turn. One station may be a particle detector with collection optics receiving a small select portion of the light scattered from the wafer surface. A second station may be a roughness detector with a collection system to direct a large portion of scattered light to a detector. A position sensitive detector may be used to determine the slope of the wafer surface at an inspection point when the wafer is not clamped to the chuck, giving a measure of surface deformation. These or other stations are positioned about either of two inspection points at which the beam from the light source may be directed. The inspection points are spaced one wafer radius apart to minimize the required wafer motion for a complete surface scan.

Particle detector for rough surfaces

A method and apparatus for predicting the number of contaminant particles in circuit area of a patterned semiconductor wafer having a number of reflective circuit areas. The method includes forming on a wafer in specified areas, a grating test pattern, such as a line grating. The grating patterns are formed at the same time and in the same manner that repetitive circuit patterns are formed on the wafer. The wafer is then scanned by a light beam. Since the diffraction pattern caused by the grating test patterns is known, it is possible to detect when the light beam is scanning one of the known grating patterns. The diffraction pattern may be inspected for fabrication derived variations. In response to detecting a known grating pattern, a detection mechanism is activated. Since the diffraction pattern is known it may be spatially separated. In this way only light scattered by particles or defects in the pattern are collected and detected. From the scattered light that is collected and detected, a particle count may be determined for the grating pattern area. From this particle count an accurate prediction of the number of particles in the circuit patterns may be made. The apparatus may also inspect bare areas. In this manner real time inspection may be performed on patterned wafers.

Particle detection on a patterned or bare wafer surface

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Santa Clara, CA, United States of America

Peter C Jann