The Boeing Company

Theboeing Company

Peter Babilo

Binil Itty Ipe Kandapallil

Randall Jay Moss

Edward R Greene

Scott Alan Adams

Giuseppe A Russo

Phillip Charles Reid

John Gerhard Keller

A system and a method include a substrate having a surface, such as an exterior surface of a vehicle. An electrophoretic display is disposed on the surface. A control unit is coupled to the electrophoretic display. The control unit is configured to selectively change one or more properties of the electrophoretic display.

Systems and methods for controlling a dynamic display

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110&#xb0; C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than &#x2212;40&#xb0; C.

Thermally conductive flexible adhesive for aerospace applications

The present disclosure relates to highly reflective coating formulations that produce coatings having an average infrared reflectivity ranging from about 75% to about 90% at wavelengths ranging from about 0.5 &#x3bc;m to about 1000 &#x3bc;m, methods for making the coatings and coating mixtures, and substrates comprising such coatings.

Salt spray-resistant metal-filled infrared reflective coating for aerospace application

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110&#xb0; C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than &#x2212;40&#xb0; C.

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Mission Viejo, CA, United States of America

Peter Babilo