3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Other

Peter B Hogerton

Karl M Kropp

Joel Arthur Gerber

Joel D Oxman

Fred Boyle McCormick

Christopher Stewart Lyons

Michael A Kropp

Ta-Hua Yu

Donna Wendeln Bange

Eric R Cybulski

Gary K Kuhn

Joseph M Pieper

Joyce B Hall

Michael R Mitchell

James P McGee

Qihong Nie

Cedric Bedoya

Yu Chen

Robert L D Zenner

Jeanne M Tingerthal

Kevin Yu Chen

Amy Preszler Prince

Mary C Kallestad

Sai-Kit Tong

Robert C Francis

Jean-Marc P Pujol

Jean-Marc Pujol

Kenneth E Carlson

Francis D Dehn

Paul T Engen

Donald J Mcclure

A radio-frequency identification tag and tape applicator. A preferred embodiment of the invention provides an applicator that includes a tag and tape handling system having a base, a tape supply holder attached to the base, a tag supply holder attached to the base, a tag applying mechanism attached to the base for applying a tag to a length of tape and that includes a taping head for applying the tag and the length of tape to an object. A preferred embodiment of the invention provides a radio-frequency identification tag applicator that includes a tag supply holder, a carrier roll holder, a carrier path from the supply roll holder to the carrier roll holder, a tag dispensing mechanism along the carrier path between the supply roll holder and the carrier roll holder for applying a tag to an object, and an interrogator for writing information to tags along the carrier path between the tag supply holder and the tag dispensing mechanism. The present invention also relates to methods of applying a radio-frequency identification tag to tape and to a variety of preferred embodiments of a package in combination with a radio-frequency identification tag.

Radio-frequency identification tag and tape applicator, radio-frequency identification tag applicator, and methods of applying radio-frequency identification tags

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding

Method of producing a laminated structure

An asset tracking system is provided, having particular usefulness in connection with the interrogation of RFID-tagged pallets by a forklift equipped with one or more RFID reader antennas. A useful embodiment of an RFID-tagged pallet is described, along with other beneficial components of such a system.

Radio frequency identification systems for asset tracking

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of the steps pre-applying adhesive directly to a bumped side of integrated circuit chip. The method also includes the step of pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Methods for making z-axis electrical connections

The present invention relates to a deformable substrate assembly for microelectronic components which includes an array of ductile metal circuit traces on a surface thereof. When an electronic component is adhesively bonded to the substrate assembly, and bonding elements from the component contact the traces, the substrate has material properties which allow individual bonding elements to locally deform the traces until the traces penetrate into the substrate surface.

Deformable substrate assembly for adhesively bonded electronic device

Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.

Reworkable adhesive for electronic applications

The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the reaction product of an admixture of an effective amount of a curable cyanate ester resin, a thermoplastic polymer, and a curing catalyst. The catalyst may be, for example, thermally or photochemically activated.

Cyanate ester adhesives for electronic applications

Growing community of inventors

White Bear Lake, MN, United States of America

Peter B Hogerton