Microsoft Technology Licensing, LLC

Peter Anthony Atkinson

William Paul Hovis

Garrett Douglas Blankenburg

Robert James Ray

Brian K Langendorf

Andres Felipe Hernandez Mojica

Erng-Sing Wee

Samy Boshra-Riad

Chee Kiong Fong

Gregory Mayo Daly

Andres Felipe Hernandez

Eric Oliver Mejdrich

Russell Dean Hoover

Mark William Casebolt

Duane Martin Evans

Harjit Singh

Suet Fong Tin

Steven William Ranta

Perry Samuel Stultz

Ying Liang

Jay Shih Tsao

James Adam Hunter

Jeremy Braun

Michael Grassi

Francine Mary Shammami

Raul Rodriguez-Montanez

Jelena H Larsen

Brian Keith Langendorf

Disclosed herein is a modular computing device that provides a user options to upgrade an existing computing device as improved expansion units become available without rendering the underlying base unit obsolete. The base unit of the modular computing device receives high-voltage AC power and one or more power supplies within the base unit converts the AC power to low-voltage DC power that is consumed within the base unit. An AC power transfer unit transfers AC power from the base unit to an expansion unit installed within an expansion dock of the base unit. One or more power supplies within the expansion unit convert the received AC power to low-voltage DC power that is consumed within the expansion unit.

Modular computing device with common AC power

An example method for adjusting operation of an integrated circuit includes testing a plurality of electronic elements of the integrated circuit including one or more redundant electronic elements designated as inactive according to a manufacturer's default configuration of the integrated circuit to determine one or more operating parameters of the integrated circuit. The method further includes selecting a subset of electronic elements from the plurality of electronic elements based on the one or more operating parameters, wherein the subset of electronic elements is designated as active according to an updated configuration of the integrated circuit, and controlling operation of the integrated circuit using the updated configuration instead of the manufacturer's default configuration.

Integrated circuit operation adjustment using redundant elements

Power reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method includes executing a voltage characterization service for a processing device of a computing apparatus to determine at least one supply voltage for the processing device, the voltage characterization service comprising a functional test that exercises the processing device at iteratively adjusted voltages in context with associated system elements of the computing apparatus. During execution of the voltage characterization service, the method includes monitoring for operational failures of at least the processing device, and responsive to the operational failures, determining at least one resultant supply voltage.

Processor device supply voltage characterization

A computing device is provided that includes a processor, a primary power supply, and a voltage regulation module. The voltage regulation module is configured to determine a load line for the processor and monitor a voltage and a current to the processor. While monitoring the voltage and current, the voltage regulation module is further configured to regulate the voltage to the processor to trend toward a voltage setpoint defined by the load line. While regulating the voltage, the voltage regulation module is further configured to clamp the load line at a clamping voltage to limit the regulated voltage output by the voltage regulation module from falling below a predetermined device minimum operation voltage when the monitored current exceeds a device maximum current value. The voltage regulation module is further configured to output electrical power at the regulated voltage to the processor.

Load line regulation via clamping voltage

Voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method of determining operating voltages for a processing device includes executing a voltage adjustment process to determine at least one input voltage for the processing device lower than a manufacturer specified operating voltage. During the voltage adjustment process, the method includes applying incrementally adjusted input voltages to the processing device, operating the processing device according to a functional test that exercises the processing device in context with associated system elements of a computing assembly, and monitoring for operational failures of at least the processing device during application of each of the incrementally adjusted input voltages. Responsive to the operational failures, the method includes determining corresponding values of the incrementally adjusted input voltages and establishing an input voltage based at least in part on the corresponding values of the incrementally adjusted input voltages.

Input voltage reduction for processing devices

Thermal reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In a first example, a method of operating a voltage control system for a processing device includes operating the processing device in a computing assembly at a selected performance level, the processing device supplied with at least one input voltage at a first voltage level. The method includes monitoring thermal information associated with the computing assembly, and when the thermal information indicates a temperature associated with the computing assembly exceeds a threshold temperature, adjusting the at least one input voltage level supplied to the processing device to a second voltage level lower than the first voltage level and continuing to operate the processing device at the selected performance level.

Voltage based thermal control of processing device

A method for controlling a cooling system for a device includes determining a power load of the processing system, determining a power load of the device, setting a first thermal setpoint based at least in part on the power load, determining a temperature of the device, adjusting a response of the cooling system based at least in part on the first thermal setpoint, detecting a change in the power load of the device to a higher power load having a higher magnitude acoustic response, in response to detecting the change in the power load, setting a second thermal setpoint having a lower magnitude acoustic response at the higher power load, the second thermal setpoint being based at least in part on a determined second corresponding acoustic response curve, and adjusting the response of the cooling system based at least in part on the second thermal setpoint.

Power based thermal management of device

Power reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method includes receiving a voltage characterization service over a communication interface of the computing apparatus as transferred by a deployment platform remote from the computing apparatus. The method includes executing the voltage characterization service for a processing device of the computing apparatus to determine at least one input voltage for the processing device lower than a manufacturer specified operating voltage, the voltage characterization service comprising a functional test that exercises the processing device at iteratively adjusted voltages in context with associated system elements of the computing apparatus. During execution of the voltage characterization service, the method includes monitoring for operational failures of at least the processing device, and responsive to the operational failures, restarting the processing device using a recovery voltage higher than a current value of the iteratively adjusted voltages.

Processor device voltage characterization

Secure voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method of controlling operating voltages for a processing device includes initializing a security portion of the processing device after application of input voltages to the processing device as supplied by voltage regulation circuitry according to voltage identifiers (VIDs) established for the processing device. The method includes, in the security portion, generating adjusted input voltages based on at least the VIDs and authenticated voltage offset information stored according to a digitally signed security process, and instructing the voltage regulation circuitry to supply the adjusted input voltages to the processing device.

Secure input voltage adjustment in processing devices

An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.

Edge plated printed circuit board

A communication system where first and second devices communicate concurrently and bidirectionally over a single wire and a ground. The second device can be a computing device having a powered component which requires a certain power output, for instance, and the first device may be a power supply unit. The second device provides a signal on a control line (the single wire) which is characterized by a frequency, pulse width, duty cycle and/or an amplitude which is associated with a message from the second device. The first device recognizes the message in the signal and invokes a corresponding function, such as by enabling a corresponding power supply. The power supply provides power to the second device via a separate power line. Further, the first device modifies the signal, without adding power, to provide a message from the first device, concurrent with the message from the second device.

Single wire concurrent bi-directional communication for PSU

A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.

Growing community of inventors

Sammamish, WA, United States of America

Peter Anthony Atkinson