Kemet Electronics Corporation

Peter Alexandre Blais

John Bultitude

Lonnie G Jones

Galen W Miller

Mark R Laps

Allen Templeton

James A Burk

Hunter Hayes

Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

Component assemblies and embedding for high density electronics

Growing community of inventors

Milpitas, CA, United States of America

Peter Alexandre Blais