Lucent Technologies Inc.

Ashland Chemical, Inc.

Peter Albert Yurcick

Harvey J Richards

Raymond Scott Harvey

John J Burack

Daniel Joseph Riley

An solvent-based pressure sensitive adhesive (PSA) having improved shear adhesion is composed of an acrylic-based PSA resin, an ethylenically unsaturated polyester, an ultraviolet radiation (UV) photosensitizer, and fugative organic solvent for the acrylic-based PSA resin. The PSA is cured by evaporation of the fugative organic solvent coupled with heat and UV irradiation or UV irradiation alone. Such PSA has improved shear adhesion by dint of the addition of the ethylenically-unsaturated polyester and an ultraviolet radiation (UV) photosensitizer. A method for adhering two substrates using the PSA includes applying the PSA to one or both of substrates. The solvent in the PSA is evaporated from the applied PSA. Finally, the polyester component of the applied PSA is cured by exposure of the applied PSA to ultraviolet (UV) radiation.

UV post curable pressure sensitive adhesives for membrane switch applications and their Production

A pressure-sensitive, flame-retardant adhesive is disclosed comprising a composition fabricated with the polymerization of acrylic esters, dibromostyrene, and vinyl phosphonic acid, with or without acrylic acid, mixed with dispersions of antimony trioxide. The adhesive composition preferably is an emulsion polymer fabricated with dibromostyrene, 2-ethylhexyl acrylate, n-butyl acrylate, and vinyl phosphonic acid, mixed with Sb.sub.2 O.sub.3 in an approximate ratio of 100 parts polymer per about 8-12 parts Sb.sub.2 O.sub.3. Preferred polymers are those containing at least about 11.6% to 15.6% bromine and from 0.25 to 2.5% phosphorous. The adhesive is particularly advantageous in fabricating optical circuit devices.

Growing community of inventors

Columbus, OH, United States of America

Peter Albert Yurcick