Rca Inc.

Sarnoff Corporation

Sri International

Digital Imaging Systems Gmbh

Other

Dialog Semiconductor Gmbh

David Sarnoff Research Center, Inc.

Dialog Imaging System Gmbh

Peter Alan Levine

Donald J Sauer

Nathaniel Joseph McCaffrey

John Robertson Tower

Pradyumna Kumar Swain

Mahalingam Bhaskaran

Rui Zhu

Robert Amantea

Ramon Ubaldo Martinelli

Taner Dosluoglu

Gary Hughes

Norman Goldsmith

Robert Michael Guidash

Lubomir L Jastrzebski

Peter Zalud

Francis Paul Pantuso

Thomas Lee Vogelsong

Walter F Kosonocky

Peter Jeffrey Burt

Sek Meng Chai

Sidney L Bendell

Allen L Limberg

Namwoong Paik

Gooitzen Sieman Van Der Wal

David Chao Zhang

Michael Raymond Piacentino

Donald F Battson

Cydney A Johnson

John F Monahan

Robin Mark Adrian Dawson

Gary Ray Peterson

Thomas Richard Senko

Neil J McCaffrey

Frank P Pantuso, Sr

Robert F Wood, Jr

Arthur L Cobb, Jr

Robert James Andreas

Kantilal Patel

In general, the disclosure describes a sensor comprising a photo-sensitive silicon substrate configured to detect ultraviolet (UV), visible, and near-infrared (NIR) light and an upconversion layer comprising a plurality of crystals configured to convert short wave infrared light to UV, visible, or NIR light. An example sensor includes an upconversion layer comprising a plurality of crystals configured to convert electromagnetic radiation comprising a first range of wavelengths greater than 1100 nm to electromagnetic radiation comprising a second range of wavelengths less than or equal to 1100 nm and a photo-sensitive silicon substrate configured to detect the electromagnetic radiation comprising the second range of wavelengths.

Sensor with upconversion layer

An imaging system for capturing light over a wide dynamic range and method for operating the same are provided. In some aspects, the method includes positioning an imaging pixel to image a scene described by light signals that extend over a wide dynamic range, and selecting a different integration time for at least two photodiodes in the imaging pixel based on light signals received by the imaging pixel, wherein the photodiodes are coupled to a sense node, and each photodiode is controlled using a different transfer gate. The method also includes performing a readout of the imaging pixel using a readout circuit connected to the sense node, wherein a capacitance associated with the sense node is modified during the readout of the at least two photodiodes.

Extended dynamic range imaging sensor and operating mode of the same

An apparatus and method for diagnosing and/or treating autonomic dysregulation is disclosed. In a preferred embodiment, a user is presented stressful audio-visual content at a known time. The resulting amount of deviation of the user's autonomic nervous system from stasis is automatically quantified periodically subsequent to the presentation of the stressful audio-visual content by monitoring a parameter of the user's heartbeat over time, thus automatically measuring both the amount of disturbance in the user's autonomic nervous system, and the re-settling time of the user's autonomic nervous system for given stressful audio-visual content. The apparatus may then guide the user through one or more awareness exercises, and subsequently re-measure the user's response to stressful audio-visual content.

Means and methods for facilitating trauma integration

An imager has an array of pixels arranged in rows and columns, readout circuitry electrically coupled to the columns to receive signals from the pixels, the readout circuitry having at least one signal path with gain switching, and a threshold detector electrically coupled to the readout circuitry to set a gain to be applied by the readout circuitry.

Low power wide dynamic range CMOS imager output circuit having a threshold detector to set a gain to be applied by a readout circuitry

A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate, and resulting imaging device is disclosed. The device includes an insulator layer; a semiconductor substrate, having an interface with the insulator layer; an epitaxial layer grown on the semiconductor substrate by epitaxial growth; and one or more imaging components in the epitaxial layer in proximity to a face of the epitaxial layer, the face being opposite the interface of the semiconductor substrate and the insulator layer, the imaging components comprising junctions within the epitaxial layer; wherein the semiconductor substrate and the epitaxial layer exhibit a net doping concentration having a maximum value at a predetermined distance from the interface of the insulating layer and the semiconductor substrate and which decreases monotonically on both sides of the profile from the maximum value within a portion of the semiconductor substrate and the epitaxial layer. The doping profile between the interface with the insulation layer and the peak of the doping profile functions as a 'dead band' to prevent dark current carriers from penetrating to the front side of the device.

Dark current reduction in back-illuminated imaging sensors

A method and apparatus for optimizing image quality based on scene content comprising a sensor for generating a sequence of frames where each frame in the sequence of frames comprises content representing a scene and a digital processor, coupled to the sensor, for performing scene content analysis and for establishing a window defining a number of input frames from the sensor and processed output frames, and for aligning and combining the number of frames in the window to form an output frame, wherein sensor parameters and frame combination parameters are adjusted based on scene content.

Method and apparatus for optimizing image quality based on scene content

A method of operating a CMOS pixel is disclosed. The CMOS pixel includes a photodiode (PPD), a transfer gate coupled to the PPD, and an anti-blooming drain coupled to the transfer gate. A potential barrier is formed between a potential well underlying the PPD and the transfer gate. Charge is accumulated in the potential well in response to electromagnetic radiation during a first integration time. Excess charge is removed from the potential well to the anti-blooming drain that exceeds the first potential barrier. A size of the potential barrier is increased. Charge is accumulated in the potential well during a second integration time.

High dynamic range CMOS pixel and method of operating same

A pixel design is disclosed. The pixel includes a photo-sensitive element. A first reflective layer substantially overlies the photo-sensitive element. A second reflective layer substantially underlies the photo-sensitive element and forms a cavity with the first reflective layer that is non-resonant with respect to photon absorption. An aperture is formed in either the first reflective layer or the second reflective layer. When electromagnetic radiation enters the aperture, the first reflective layer and the second reflective layer are configured to reflect the electromagnetic radiation substantially toward each other until substantially absorbed in the cavity.

Night vision CMOS imager with optical pixel cavity

A non-linear conversion capability within an on-chip, per-column analog-to-digital converter (ADC) is provided to expand a compressed analog signal such that the resulting digital output that has a predetermined (linear or non-linear) mapping with respect to input brightness level of an incoming light signal to a row of pixels. The predetermined mapping may also be provided by a non-linear amplifier coupled to a linear or non-linear ADC and a resulting compressed non-linear digital representation at the output of the ADC is substantially linearized by an on-chip or an off-chip look-up table (LUT).

CMOS imager with companded column signals

A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate is disclosed. The substrate includes an insulator layer and an epitaxial layer overlying the insulator layer. A bond pad region is formed extending into the epitaxial layer to a surface of the insulator layer. A bond pad is fabricated partially overlying the bond pad region. At least one imaging component is fabricated partially overlying and extending into the epitaxial layer. A passivation layer is fabricated overlying the epitaxial layer, the bond pad, and the at least one imaging component. A handle wafer is bonded to the passivation layer. A portion of the insulator layer and a portion of the bond pad region is etched to expose a portion of the bond pad.

Method of fabricating back-illuminated imaging sensors

A method and apparatus for equalizing gain in an array of electron multiplication (EM) pixels is disclosed, each pixel having one or more impact ionization gain stages with implants to achieve charge transfer directionality and comprising a phase 1 clocked gate, an EM clocked gate, and two DC gates formed between the phase 1 clocked gate and the EM clocked gate, comprising the steps of (a) applying initial voltages to each of the DC gates and the EM clocked gates of at least two pixels of a plurality of pixels; (b) clocking phase 1 clock gates and an EM clock gates associated with the at least two pixels of the plurality of pixels a predetermined number of times to achieve an average pixel intensity value after impact ionization gain; and (c) selectively adjusting the difference in voltage between the DC gate and corresponding EM clocked gate of the at least two pixels of the plurality of pixels until the difference between the resulting pixel intensity values and the average pixel intensity value needed to produce a desired uniform gain image is below a predetermined threshold.

Gain matching for electron multiplication imager

A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate, and resulting imaging device is disclosed. The method for manufacturing the imaging device includes the steps of providing a substrate comprising an insulator layer, and an epitaxial layer substantially overlying the insulator layer; fabricating at least one imaging component at least partially overlying and extending into the epitaxial layer; forming a plurality of bond pads substantially overlying the epitaxial layer; fabricating a dielectric layer substantially overlying the epitaxial layer and the at least one imaging component; providing a handle wafer; forming a plurality of conductive trenches in the handle wafer; forming a plurality of conductive bumps on a first surface of the handle wafer substantially underlying the conductive trenches; and bonding the plurality of conductive bumps to the plurality of bond pads.

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

A method for fabricating a back-illuminated semiconductor imaging device on an ultra-thin semiconductor-on-insulator substrate (UTSOI) is disclosed. The UTSOI substrate is formed by providing a handle wafer comprising a mechanical substrate and an insulator layer substantially overlying the mechanical substrate. A donor wafer is provided. Hydrogen is implanted in the donor wafer to form a bubble layer. The donor wafer is doped with at least one dopant to form a doped layer proximal to the bubble layer. The handle wafer and the donor wafer are bonded between the insulator layer of the handle wafer and a surface of the donor wafer proximal to the doped layer to form a combined wafer having a portion substantially underlying the bubble layer. The portion of the combined wafer substantially underlying the bubble layer is removed so as to expose a seed layer. An epitaxial layer is grown substantially overlying the seed layer, wherein at least one dopant diffuse into the epitaxial layer. At the completion of the growing of the epitaxial layer, there exists a net dopant concentration in the seed layer and the epitaxial layer which has maximum value at or near an interface between the seed layer and the insulator layer.

Back-illuminated imager using ultra-thin silicon on insulator substrates

A new method of reading an imager is achieved. The method comprises providing an imager array comprising n rows and m columns where a pair of rows can be read during a single row access time. A first image field is completed by sequentially reading and storing pixel values of pairs of adjacent rows of the imager array. The reading begins at a first row, and the reading stops when less than three rows are unread. Thereafter pixel values of the next row are read and not stored. Thereafter pixel values of the first row of the imager array are read and not stored. A second image field is completed by sequentially reading and storing pixel values of pairs of adjacent rows. The reading begins at the second row, the reading stops when less than two rows are unread.

Simultaneous readout of CMOS APS imagers

Growing community of inventors

West Windsor, NJ, United States of America

Peter Alan Levine